Benzoxazinyl modified polyhedral oligomeric silsesquioxane (BZPOSS) is successfully synthesized and used to prepare nanocomposites with bisphenol A type epoxy resin (E51). The differential scanning calorimetry results showed the curing peak temperature of E51/BZPOSS blend decrease to 242°C, suggesting the high catalytic activity of BZPOSS to the polymerization of E51. The scanning electron microscope micrographs of poly(E51/BZPOSS)s and silicon element distribution maps given by EDS both demonstrated homogeneous dispersion of BZPOSS. Dielectric properties tests confirmed the dielectric constant can be reduced by the introduction of BZPOSS, which is attributed to the nano‐pores from the cage structure of POSS. When 20 wt% BZPOSS was added, the dielectric constant decreased to 2.28 at 1 MHz. Meanwhile, DMA and TGA results indicated the thermal stability and heat resistance of poly(E51/BZPOSS)s at high temperature increased with the increase of BZPOSS, which is due to the increase of the crosslinking density and the change of crosslinking structure of copolymer.

中文翻译：

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介电常数低，热稳定性优异的环氧/苯并恶嗪基POSS纳米复合树脂

成功地合成了苯并恶嗪基改性的多面体低聚倍半硅氧烷（BZPOSS），并用于制备双酚A型环氧树脂（E51）的纳米复合材料。差示扫描量热法结果表明，E51 / BZPOSS共混物的固化峰值温度降低到242℃，表明BZPOSS对E51的聚合具有很高的催化活性。聚（E51 / BZPOSS）的扫描电子显微镜显微照片和EDS给出的硅元素分布图均显示BZPOSS均匀分散。介电性能测试证实，通过引入BZPOSS可以降低介电常数，这归因于POSS笼形结构的纳米孔。当添加20wt％的BZPOSS时，介电常数在1MHz下降低至2.28。与此同时，