Owing to the isothermal solidification of eutectic Au-Si filler, NiTi joint that could endure 700 °C has been successfully manufactured at 430 °C for the first time. The joining temperauture is within the aging temperature range, which is harmless to the properties of the NiTi base metal. A total consumption of the eutectic Si leaves a seam full of Au, whiskers and nanocrystalline layers due to the reaction of Si and NiTi. With the high-density stacking faults, the nanocrystalline layers at the interface exhibits ultra-high mechanical property, which strengthen the interfaces.

中文翻译：

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Ni-Ti形状记忆合金的Au-Si等温凝固过程的低温连接

由于共晶Au-Si填料的等温凝固，首次能够在430°C的温度下成功制造出可承受700°C的NiTi接头。接合温度在时效温度范围内，这对NiTi基体金属的特性无害。由于Si和NiTi的反应，共晶Si的总消耗留下了充满Au，晶须和纳米晶层的接缝。由于存在高密度堆叠缺陷，界面处的纳米晶体层表现出超高的机械性能，从而增强了界面。