ABSTRACT Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.

中文翻译：

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电子封装用低温无铅焊料的微观结构和性能研究

摘要 低温焊料（In基、Sn-Bi、Sn-Zn）由于其独特的低温特性，在IBM主机中的航空航天和通孔技术组装中具有很大的优势。该综述评估了合金元素、稀土元素和纳米粒子对低温焊料的润湿性、微观结构、机械性能和抗氧化性的影响。