Direct MOCVD growth of iron oxide on three-dimensional nickel foam as electrode for the oxygen evolution reaction.,ChemSusChem

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Direct MOCVD growth of iron oxide on three-dimensional nickel foam as electrode for the oxygen evolution reaction.
ChemSusChem ( IF 7.5 ) Pub Date : 2020-09-14 , DOI: 10.1002/cssc.202001896
Christian Stienen ₁ , Georg Bendt ₁

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Iron oxide thin films were grown directly on three‐dimensional nickel foam via metalorganic chemical vapor deposition (MOCVD) in the temperature range of 250–450 °C using Fe(CO)₅ as precursor. Iron oxide (α‐Fe₂O₃) films were formed at low substrate temperatures (250–350 °C), whereas the additional growth of an underlying NiO film occurred at substrate temperatures above 350 °C. The electrochemical activities of the as‐formed binder‐free and noble metal‐free electrodes were tested for the oxygen evolution reaction (OER) in alkaline media. An overpotential reduced by 250 mV at a current density of 50 mA cm⁻² and a lower Tafel slope of 55 mV dec⁻¹ compared to bare nickel foam were found for the best‐performing electrocatalyst, while the long‐term stability of the as‐formed electrodes was proven by chronopotentiometry. The surface morphology of the iron oxide films was characterized by scanning electron microscopy, whereas the crystallographic phase as well as the elemental composition were determined by X‐ray diffraction, energy‐dispersive X‐ray spectroscopy, X‐ray photoelectron spectroscopy, and time‐of‐flight secondary ion mass spectrometry in the pre‐ and the post‐catalytic state.

中文翻译：

在三维泡沫镍上的氧化铁直接MOCVD生长，作为氧释放反应的电极。

在250-450°C的温度范围内，以Fe（CO）₅为前体，通过金属有机化学气相沉积（MOCVD）在三维泡沫镍上直接生长氧化铁薄膜。氧化铁（的α-Fe ₂ ö ₃）在低的衬底温度（250-350℃）形成的膜，而底层NiO膜的额外的生长发生在衬底温度高于350℃。测试了所形成的无粘合剂和无贵金属电极的电化学活性，以了解碱性介质中的氧释放反应（OER）。在50 mA cm ^-2的电流密度和55 mV dec ^-1的较低Tafel斜率下，过电势降低250 mV与裸镍泡沫相比，它是性能最佳的电催化剂，而计时电位法证明了所形成电极的长期稳定性。氧化铁膜的表面形貌通过扫描电子显微镜表征，而结晶相和元素组成则通过X射线衍射，能量色散X射线光谱，X射线光电子光谱和时间来确定。催化前和催化后的飞行中二次离子质谱

更新日期：2020-11-21

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