The hardness and toughness of HfN films alloying with Ta element is crucial for their wear resistance when they are applied in the harsh environment. In this study, Ta_xHf_1−xN (x = 0–1) thin films with various Ta contents were deposited on silicon wafer and TC4 alloy substrates by DC reactive magnetron sputtering, respectively. The relationship between structure, mechanical and tribological properties of Ta_xHf_1−xN films was investigated. Ta_xHf_1−xN films are presented as the solid solutions with B1-NaCl rock salt structure. As the content of tantalum increases, the grain size and residual compressive stress of Ta_xHf_1−xN films increases firstly then decreases, while the preferred orientation transfers from (111) to (200) and then back to (111). The hardness and H/E increases initially and then decreases with the Ta contents, which is also consistent with the fracture toughness. When x is 0.58, Ta_xHf_1−xN film shows the maximum hardness value (44 GPa), H/E (0.15), H³/E² (1.02 GPa), fracture toughness (3.48 MPa·m^1/2) and lower wear rate (5.6 × 10⁻⁶ mm³/Nm). It is found that the wear resistance of Ta_xHf_1−xN films is directly related to the H/E and fracture toughness.

与Ta元素合金化的HfN膜的硬度和韧性对于在恶劣环境中使用时的耐磨性至关重要。在这项研究中，通过直流反应磁控溅射分别在硅片和TC4合金衬底上沉积了具有不同Ta含量的Ta _x Hf _1-x N（x = 0-1）薄膜。研究了Ta _x Hf _1-x N薄膜的结构，力学性能和摩擦学性能之间的关系。Ta _x Hf _1-x N薄膜作为具有B1-NaCl岩盐结构的固溶体呈现。随着钽含量的增加，Ta _x Hf _1-x的晶粒尺寸和残余压应力N薄膜先增加然后减少，而优选的取向从（111）转移到（200），然后又回到（111）。硬度和H / E随Ta含量的增加先增加，然后降低，这也与断裂韧性一致。当x为0.58时，Ta _x Hf _1-x N膜显示最大硬度值（44 GPa），H / E（0.15），H ³ / E ²（1.02 GPa），断裂韧性（3.48 MPa·m ^1/2）），降低磨损率（5.6×10 ^-6  mm ³ / Nm）。发现Ta _x Hf _1-x N膜的耐磨性与H / E和断裂韧性直接相关。