Defective adhesive bonds pose significant threats towards structural integrity due to reduced joint strength. The nature of the adhesion of two solids remains poorly understood since the adhesion phenomenon is relevant to so many scientific and technological areas. A concept that has been gaining our attention from the perspective of non-destructive testing is the properties discontinuity of the adhesion. Discontinued properties depend significantly on the quality of the interface that is formed between adhesive and substrate. In this research, discontinued electrical properties at the interface are considered. The simplified model is free from multidisciplinary knowledge of chemistry, fracture mechanics, mechanics of materials, rheology and other subjects. From a practical standpoint, this emphasizes the need to establish a good relationship between electrical properties of adhesive bonds and corresponding measurements. Capacitive imaging (CI) is a technique where the dielectric property of an object is determined from external capacitance measurements. Thus, it is potentially promising since adhesive and substrate differ in terms of dielectric property. At the interface between adhesive and substrate, discontinuity of the dielectric properties causes abrupt changes in electric field spatial distribution and thus alters capacitance measurement by simulating defects in adhesive joints regarding permittivity uncertainties. Further understanding of the cause of degraded adhesion quality can be obtained. This article is part of the theme issue ‘Advanced electromagnetic non-destructive evaluation and smart monitoring’.

中文翻译：

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用于粘合剂粘合和质量评估的电容成像

由于接头强度降低，有缺陷的粘合剂对结构完整性构成重大威胁。两种固体的粘附性质仍然知之甚少，因为粘附现象与许多科学和技术领域相关。从无损检测的角度来看，一个引起我们关注的概念是粘附的特性不连续性。停产的特性在很大程度上取决于粘合剂和基材之间形成的界面的质量。在这项研究中，考虑了界面处不连续的电气特性。简化模型不受化学、断裂力学、材料力学、流变学和其他学科的多学科知识的影响。从实用的角度来看，这强调需要在粘合剂的电性能和相应的测量值之间建立良好的关系。电容成像 (CI) 是一种通过外部电容测量来确定物体介电特性的技术。因此，由于粘合剂和基材在介电性能方面不同，因此它具有潜在的前景。在粘合剂和基板之间的界面处，介电特性的不连续性导致电场空间分布的突然变化，从而通过模拟粘合剂接头中有关介电常数不确定性的缺陷来改变电容测量。可以进一步了解粘附质量下降的原因。本文是主题问题“高级电磁无损评估与智能监测”的一部分。