A silver shell‑copper core coating was applied on additively manufactured (AM) AlSi10Mg alloy to improve the electrical conductivity, corrosion resistance, surface roughness and indentation hardness. Surface microstructure evolution and roughness of the AM alloy, i.e. as-built, during the subsequent processes, such as heat treatment, shot peening and AgCu coating, were comprehensively characterized using secondary electron imaging in a scanning electron microscope and a scanning laser microscope, respectively. Also, the surface indentation hardness of the coated alloy was evaluated to study the mechanical response. The corrosion behavior and electrical conductivity of the AgCu coated AM alloy were evaluated and compared with the as-built and shot peened AM alloy using the electrochemical and the electrical resistivity measurements, respectively. The results showed that the AgCu coating could significantly increase the surface hardness of the AM AlSi10Mg four times along with an average of 60% improvement in roughness. The electrochemical characterization shows a significant increase in the corrosion resistance for the AgCu coated AM AlSi10Mg with a low corrosion current density of 4 μmA/cm² in a chloride solution compared to the uncoated alloy. Finally, it was observed that the AgCu coating leads to reduction of the electrical resistance of the studied AM alloy by 40%. Consequently, the electrical conductivity property of the coated AM AlSi10Mg increases.

在增材制造（AM）的AlSi10Mg合金上涂了一层银壳铜芯涂层，以改善导电性，耐腐蚀性，表面粗糙度和压痕硬度。利用扫描电子显微镜和扫描激光显微镜中的二次电子成像技术，全面表征了AM合金（在随后的过程中，如热处理，喷丸处理和Ag Cu涂层）在制造过程中的表面微观结构演变和粗糙度，分别。另外，评估了涂层合金的表面压痕硬度以研究机械响应。银的腐蚀行为和电导率评估了镀铜的AM合金，并分别使用电化学和电阻率测量结果将其与制成的喷丸AM合金进行了比较。结果表明，Ag Cu涂层可以显着提高AM AlSi10Mg的表面硬度四倍，并且粗糙度平均提高60％。电化学表征显示，与未涂覆的合金相比，在氯化物溶液中具有4μmA/ cm ²的低腐蚀电流密度的Ag Cu涂覆的AM AlSi10Mg的耐腐蚀性显着提高。最后，观察到Ag铜涂层导致所研究的AM合金的电阻降低40％。因此，涂覆的AM AlSi10Mg的电导率特性增加。