The thermally insulated inclined or circular arc cracks problems subjected to axial stress in the upper part of bonded two half planes are considered. The modified complex potential function method with the continuity conditions of the resultant force, displacement, and heat conduction functions is used to develop the new system of hypersingular integral equations (HSIEs) for the problems. The new system of HSIEs is solved numerically for the unknown crack opening displacement function and the known traction along the crack as the right-hand term using the appropriate quadrature formulas. Numerical results for the nondimensional stress intensity factors (SIFs) at all cracks tips are presented. A comparison between the nondimensional SIFs for cracks with and without thermal influence is also given

中文翻译：

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被隔热裂纹削弱的粘合两个半平面的应力强度因子

考虑了粘结的两个半平面上部受轴向应力作用下的隔热倾斜或圆弧裂纹问题。使用具有合力、位移和热传导函数的连续性条件的修正复势函数方法来开发新的超奇异积分方程 (HSIE) 系统来解决这些问题。HSIE 的新系统以未知的裂纹张开位移函数和已知的沿裂纹牵引力为右手项，使用适当的求积公式进行数值求解。给出了所有裂纹尖端的无量纲应力强度因子 (SIF) 的数值结果。还给出了有和没有热影响的裂纹的无量纲 SIF 之间的比较