The static mechanical properties of conventional rigid and emerging soft electronics offer robust handling and interfacing mechanisms and highly compliant and adapting structures, respectively, but limit their functionalities and versatility. Mechanically transformative electronics systems (TESs) have extensive potential applications beyond these existing electronics technology owing to their ability to achieve both rigid and soft features as a result of bidirectional reconfiguration of their mechanical structure under the influence of stimuli (e.g. heat, electric/magnetic field, light, stress). In this article, we review recent advances in materials and fabrication methods as well as their applications for the development of TESs. We present key requirements for TESs and cover a range of stimuli-responsive materials and design strategies. Potential applications with demonstrated utility in wearables, implantable devices, sensors, and robotics, alongside key challenges and opportunities in the development of this emerging technology, are also discussed.

传统刚性和新兴软电子产品的静态机械性能分别提供了强大的处理和接口机制以及高度顺应和适应的结构，但限制了它们的功能和多功能性。机械变形电子系统（TES）由于在刺激（例如热，电场/磁场）的作用下对其机械结构进行双向重新配置而具有刚性和软性的功能，因此具有超越这些现有电子技术的广泛应用潜力，光线，压力）。在本文中，我们将回顾材料和制造方法的最新进展及其在TES开发中的应用。我们提出了TES的关键要求，并涵盖了多种刺激响应材料和设计策略。