Abstract Maskless electrochemical micromachining (EMM) is a prominent and unique surface texturing method to fabricate the arrays of microslots. This article investigates the generation of microslot arrays using maskless EMM method. The developed prototype maskless EMM setup consists of EMM cell, power supply connections, electrode holding devices and constricted vertical cross flow electrolyte system for the fabrication of microslot arrays economically. One textured cathode tool with SU-8 2150 mask is used to produce 22 microslot arrays. Influences of EMM process parameters including voltage, electrolyte concentration, inter electrode gap, flow rate and machining time on the machining performance that is, width overcut, depth and surface roughness (Ra) of microslot arrays are investigated. For lower width overcut, controlled depth, and lower surface roughness, machining with lower voltage, lower electrolyte concentration, lower inter electrode gap, higher flow rate and lower machining time are recommended. From the analysis, it is observed that the best machining conditions including inter electrode gap of 50 μm, applied voltage of 6 V, electrolyte concentration of 20 g L−1, flow rate of 5.35 m3 hr−1 and machining time of 1 min fabricate regular microslot array with mean width overcut of 24.321 μm, mean machining depth of 10.7 μm and mean surface roughness of 0.0101 μm.

中文翻译：

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电化学微加工制备微槽阵列的研究

摘要 无掩模电化学微加工 (EMM) 是一种突出且独特的表面纹理化方法，用于制造微槽阵列。本文研究了使用无掩模 EMM 方法生成微槽阵列。开发的原型无掩模 EMM 设置包括 EMM 单元、电源连接、电极保持装置和用于经济地制造微槽阵列的收缩垂直交叉流电解液系统。一种带有 SU-8 2150 掩模的纹理阴极工具用于生产 22 个微槽阵列。研究了电压、电解液浓度、电极间间隙、流速和加工时间等 EMM 工艺参数对加工性能的影响，即微槽阵列的宽度过切、深度和表面粗糙度 (Ra)。对于较低的宽度过切，控制深度，建议使用较低的表面粗糙度、较低的电压、较低的电解液浓度、较低的电极间隙、较高的流速和较短的加工时间。从分析中可以看出，最佳加工条件包括电极间隙为 50 μm、施加电压为 6 V、电解液浓度为 20 g L−1、流速为 5.35 m3 hr−1 和加工时间为 1 min规则的微槽阵列，平均宽度过切为 24.321 μm，平均加工深度为 10.7 μm，平均表面粗糙度为 0.0101 μm。