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Stability analysis for SiC grinding based upon harmonic wavelet and Lipschitz exponent
Machining Science and Technology ( IF 2.7 ) Pub Date : 2019-08-02 , DOI: 10.1080/10910344.2019.1575398
Qing Li 1 , Xia Ji 1 , Jianguo Yang 1 , Steven Y. Liang 1, 2
Affiliation  

Abstract In order to effectively identify the stability degree of grinding and obtain better surface integrity of machined workpiece in grinding application, in this paper, a quantitative assessment approach based on harmonic wavelet and Lipschitz exponent is proposed, using silicon carbide as an example. To begin with, the Lipschitz exponent is defined and calculated by harmonic wavelet modulus maxima (HWMM) and linear regression algorithm, respectively. Then the Kurtosis based on Lipschitz exponent (KLE) is defined as a quantitative indicator. In grinding experiment, the acceleration signals and grinding force signals of the X/Y directions are selected, and experimental parameters including wheel speed, workpiece speed and grinding depth are employed to investigate the grinding stability in grinding stage. Experimental results show that the grinding stability is relatively worse at low wheel speed, low-high workpiece speed and large grinding depth in terms of KLE index, which may provide a new guidance to explore optimized grinding parameters and thus obtain good surface integrity in engineering applications.

中文翻译:

基于谐波小波和Lipschitz指数的SiC磨削稳定性分析

摘要 为了在磨削应用中有效识别磨削稳定性,获得更好的加工工件表面完整性,以碳化硅为例,提出了一种基于谐波小波和Lipschitz指数的定量评估方法。首先,分别通过谐波小波模极大值 (HWMM) 和线性回归算法定义和计算 Lipschitz 指数。然后将基于 Lipschitz 指数 (KLE) 的峰度定义为定量指标。在磨削实验中,选取X/Y方向的加速度信号和磨削力信号,利用砂轮速度、工件速度和磨削深度等实验参数研究磨削阶段的磨削稳定性。
更新日期:2019-08-02
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