Abstract Polypyrrole and polypyrrole/copper zinc iron oxide (copper zinc ferrite) nanocomposites were synthesized by in-situ polymerization using Ammonium Persulphate as oxidising agent. The nanocomposites were synthesized by mixing polypyrrole and copper zinc iron oxide in different weight percentages. The formation of nanocomposites and changes in the structural properties were investigated by characterizing the samples using XRD, FTIR, SEM and EDX analysis. The size of the particle was analysed by XRD using Scherrer equation and found to be in 20 nm range. DC conductivity was measured in the temperature range 300 K–473 K. The DC conductivity was found to be constant for the temperature range from 300 K–433 K. But the conductivity showed an exponential increase for the temperature 433 K–473 K, and it obeys Arrhenius relation. Activation energies were evaluated from Arrhenius plots for all compositions. Results show that incorporation of additive material significantly reduces the activation energy for the DC conductivity of the composites, and the decrease in the activation energy is also dependent on the amount of the nanoparticles in the composites. As the polymers are used in the various manufacturing products, this study indicates the possibility of using such polymers in the form of composites as superior insulating material in the fields of electrical or electronic insulation and allied areas.

中文翻译：

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聚吡咯/铜锌氧化铁纳米复合材料的合成、表征和直流电导率研究

摘要 以过硫酸铵为氧化剂，通过原位聚合法合成了聚吡咯和聚吡咯/铜锌氧化铁（铜锌铁氧体）纳米复合材料。通过将聚吡咯和铜锌氧化铁以不同的重量百分比混合来合成纳米复合材料。通过使用 XRD、FTIR、SEM 和 EDX 分析表征样品，研究了纳米复合材料的形成和结构特性的变化。使用谢乐方程通过 XRD 分析颗粒的尺寸，发现在 20 nm 范围内。在 300 K–473 K 的温度范围内测量 DC 电导率。发现 DC 电导率在 300 K–433 K 的温度范围内是恒定的。但电导率在 433 K–473 K 温度范围内呈指数增长，并且服从阿累尼乌斯关系。从所有组合物的阿伦尼乌斯图中评估活化能。结果表明，添加剂材料的加入显着降低了复合材料直流电导率的活化能，活化能的降低也取决于复合材料中纳米颗粒的数量。由于聚合物用于各种制造产品，因此本研究表明，在电气或电子绝缘领域及相关领域，以复合材料的形式使用此类聚合物作为优良绝缘材料的可能性。活化能的降低也取决于复合材料中纳米颗粒的数量。由于聚合物用于各种制造产品，因此本研究表明，在电气或电子绝缘领域及相关领域，以复合材料的形式使用此类聚合物作为优良绝缘材料的可能性。活化能的降低也取决于复合材料中纳米颗粒的数量。由于聚合物用于各种制造产品，因此本研究表明，在电气或电子绝缘领域及相关领域，以复合材料的形式使用此类聚合物作为优良绝缘材料的可能性。