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Using mesoporous carbon to pack polyethylene glycol as a shape-stabilized phase change material with excellent energy storage capacity and thermal conductivity
Microporous and Mesoporous Materials ( IF 5.2 ) Pub Date : 2020-09-12 , DOI: 10.1016/j.micromeso.2020.110631
Daili Feng , Pei Li , Yanhui Feng , Yuying Yan , Xinxin Zhang

A novel shape-stabilized phase change material was successfully prepared using polyethylene glycol (PEG) as phase change material (PCM) and mesoporous carbon FDU-15 as support via the melting impregnation method. The structural and thermal properties of materials were measured by TEM, SEM, XRD, FT-IR, nitrogen adsorption-desorption isotherms and DSC, respectively. The maximum loading of PEG/FDU-15 reaches up to 75 wt%, and the corresponding crystallization ratio is 71%, which is superior to other mesoporous-based composite PCMs. Molecular dynamic (MD) analysis showed that some PEG adhered to the pore wall with an amorphous structure which failed to crystallize, ultimately resulting in a gap between the measured latent heat and the theoretical value. It was interesting that the filling of PEG could stimulate the frequency shift of atomic vibration in FDU-15, which then just fell in the dominant vibrational zone of PEG, despite the suppressed atomic vibration of PEG after compounding. Accordingly, the thermal conductivity of the composite is more than 60% higher compared to pure PEG, which relates to the reinforced matching of the atomic vibration between the skeleton and PCM material. FDU-15 was applied to pack PCM for the first time and delivered a better thermal performance compared with other mesopore-based composite PCMs.



中文翻译:

使用中孔碳将聚乙二醇包装为形状稳定的相变材料,具有出色的储能能力和导热性

以聚乙二醇(PEG)为相变材料(PCM),以介孔碳FDU-15为载体,通过熔融浸渍法成功制备了新型的形状稳定相变材料。通过TEM,SEM,XRD,FT-IR,氮吸附-解吸等温线和DSC分别测量了材料的结构和热性能。PEG / FDU-15的最大负载量达到75 wt%,相应的结晶率为71%,这优于其他中孔基复合PCM。分子动力学(MD)分析显示,某些PEG以无定形结构粘附在孔壁上,无法结晶,最终导致测得的潜热与理论值之间存在间隙。有趣的是,尽管复合后PEG的原子振动受到抑制,但PEG的填充可以刺激FDU-15中原子振动的频移,然后FDU-15恰好落入PEG的主要振动区域。因此,复合材料的导热率比纯PEG高60%以上,这与骨架和PCM材料之间原子振动的增强匹配有关。与其他中孔基复合PCM相比,FDU-15首次用于包装PCM,并提供了更好的热性能。这与骨架和PCM材料之间的原子振动的增强匹配有关。与其他中孔基复合PCM相比,FDU-15首次用于包装PCM,并提供了更好的热性能。这与骨架和PCM材料之间的原子振动的增强匹配有关。与其他中孔基复合PCM相比,FDU-15首次用于包装PCM,并提供了更好的热性能。

更新日期:2020-09-25
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