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Development of ultrathin thermal ground plane with multiscale micro/nanostructured wicks
Case Studies in Thermal Engineering ( IF 6.4 ) Pub Date : 2020-09-12 , DOI: 10.1016/j.csite.2020.100738
Yinchuang Yang , Dong Liao , Hongzhao Wang , Jian Qu , Jian Li , Huihe Qiu

In this paper, TGPs with thickness of around 0.53–0.6 mm are developed with copper plate as the casing material, nanostructured copper foam as the wick and electroplated copper pillar as the support of vapor core. The effects of charge amount of water, nanostructured wick, the number of copper foam layers and vapor core thickness on the thermal performance of the developed TGP are experimentally studied. It is found that increasing the number of copper foam layers or vapor core thickness can greatly lower the TGP thermal resistance. Specifically, a TGP with a double layers copper foam wick has a much better thermal performance than that with single layer even though the total wick thickness and porosity remain unchanged. Experimental results also show that the multiscale micro/nanostructured wick is beneficial for improving the TGP thermal performance. Small change of vapor core thickness can lead to great change of TGP thermal performance. The ultrathin TGP can reach an effective thermal conductivity of 2207 W/(m·K) at an input power of 22.66 W over a heating area of 8 mm × 8 mm.



中文翻译:

具有多尺度微/纳米结构灯芯的超薄热接地层的开发

在本文中,开发了厚度约为0.53–0.6 mm的TGP,以铜板作为外壳材料,纳米结构的泡沫铜作为灯芯,电镀的铜柱作为蒸气芯的支撑。实验研究了水的电荷量,纳米结构的灯芯,泡沫铜层的数量和蒸气芯厚度对所开发的TGP的热性能的影响。发现增加泡沫铜层的数量或蒸气芯的厚度可以大大降低TGP热阻。具体地说,即使总的灯芯厚度和孔隙率保持不变,带有双层铜泡沫灯芯的TGP的热性能也比单层的更好。实验结果还表明,多尺度微/纳米结构灯芯有利于改善三峡工程的热性能。蒸气芯厚度的微小变化会导致TGP热性能发生很大变化。在8 mm×8 mm的加热面积下,输入功率为22.66 W时,超薄TGP的有效导热系数可达到2207 W /(m·K)。

更新日期:2020-11-13
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