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Effect of water on the electrodeposition of copper on nickel in deep eutectic solvents
Transactions of the IMF ( IF 1.2 ) Pub Date : 2019-11-02 , DOI: 10.1080/00202967.2019.1671062
A. Y. M. Al-Murshedi 1, 2 , J. M. Hartley 1 , A. P. Abbott 1 , K. S. Ryder 1
Affiliation  

ABSTRACT Most studies of metal electrodeposition in ionic liquids dry the electrolyte thoroughly, as water is thought to be detrimental. In some cases, water has a beneficial effect on deposit morphology. The electrodeposition of copper has been studied in 1ChCl: 2EG-water mixtures. It is shown here that the presence of water increases the apparent brightness of the deposit due to changes in the electrodeposit surface feature size, up to a water content of approximately 20 wt-%. This study characterises speciation and mass transport in solution, and shows that diffusion can be controlled independently of speciation. It is shown that there is an optimal water content, which is thought to originate from formation of a bi-continuous micro-emulsion phase in DES-water mixtures. Additionally, the copper species remains in a predominantly ionic medium at low water content but moves to an aqueous environment when water is the main component.

中文翻译:

水对深共熔溶剂中铜在镍上电沉积的影响

摘要 大多数关于离子液体中金属电沉积的研究都彻底干燥了电解质,因为水被认为是有害的。在某些情况下,水对沉积物形态有有益的影响。已在 1ChCl: 2EG-水混合物中研究了铜的电沉积。这里表明,由于电沉积表面特征尺寸的变化,水的存在增加了沉积物的表观亮度,直至水含量达到约 20 重量%。这项研究表征了溶液中的物种形成和质量传输,并表明扩散可以独立于物种形成而受到控制。结果表明,存在最佳含水量,这被认为源于在 DES-水混合物中形成双连续微乳液相。此外,
更新日期:2019-11-02
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