In this research work, diglycidyl ether of bisphenol-A (DGEBA) and polystyrene-block-poly(ethylene-ran-butylene)-block-polystyrene (PSPEB) were blended and loaded with purified graphene nanoplatelet (GNP-P) and acid-functionalized graphene nanoplatelet (GNP-F). Solution mixing route was used for nanocomposite processing with diaminodiphenylmethane as a hardener. According to SEM, inclusion of functional GNP-F depicted fine morphology due to interfacial adhesion between functional nanofiller and blend. Sharp increase in ultimate tensile strength and toughness was observed for DGEBA/PSPEB/GNP-F 0.03–0.1 system, i.e. 60.4–64.5 MPa and 422.6–725.5 MPa, respectively. For 0.1 wt.% GNP-P loading, T_max was observed as 547 °C; whereas, GNP-F showed higher value of 568 °C. Glass transition temperature of acid functional system was also higher (258 °C) than purified one (229 °C). DGEBA/PSPEB/GNP-F 0.1 depicted semi-crystalline nature (12.5° and 19.1°). EMI shielding effectiveness of nanocomposite was sufficiently high in the range of ~17.9–20.07 dB, i.e. desired for aerospace applications. Moreover, introduction of 0.1 wt.% functional graphene nanoplatelet enhanced the electrical conductivity up to 0.14 cm⁻¹.

在本研究工作，双酚-A（DGEBA）的二环氧甘油醚和聚苯乙烯-嵌段-聚（乙烯- RAN丁烯） -嵌段-聚苯乙烯（PSPEB）混合并装载有纯化的石墨烯纳米薄片（GNP-P）和酸功能化石墨烯纳米血小板（GNP-F）。溶液混合路线用于以二氨基二苯甲烷为硬化剂的纳米复合材料加工。根据SEM，由于功能性纳米填料和共混物之间的界面粘合，功能性GNP-F的包容表现出良好的形貌。DGEBA / PSPEB / GNP-F 0.03-0.1体系的极限抗拉强度和韧性急剧增加，分别为60.4-64.5 MPa和422.6-725.5 MPa。对于0.1 wt。％的GNP-P负载，T _max观察到为547℃。而GNP-F则显示更高的568°C值。酸官能系统的玻璃化转变温度（258°C）也高于纯化的玻璃化转变温度（229°C）。DGEBA / PSPEB / GNP-F 0.1表示半结晶性质（12.5°和19.1°）。纳米复合材料的EMI屏蔽效果在〜17.9–20.07 dB的范围内足够高，这是航空航天应用所希望的。此外，引入0.1重量％的功能性石墨烯纳米片增强了高达0.14cm ^-1的电导率。