Front Cover: Molecular dynamics simulation is used to investigate the effect of bonded interface on the mechanical performances of the PI/SiO₂ composites. The interfacial non‐bond energy, the number of the hydrogen bonds, tensile strength, Young's modulus and shear modulus are investigated. As the SiO₂ concentration increased, the non‐bond interaction energy between each PI chain and SiO₂ particle increased and the non‐bond interaction energy in the bonded composites are higher than that of the unbonded. This is reported by Yu Wang, Wenlong Yang, Xinmei Liu, Jiaqi Lin, and Hongguo Sun in article 1900045.

中文翻译：

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键合界面结构对聚酰亚胺/ SiO2复合材料力学性能的影响：分子动力学模拟

封面：分子动力学模拟用于研究键合界面对PI / SiO ₂复合材料机械性能的影响。研究了界面非键能，氢键数，拉伸强度，杨氏模量和剪切模量。随着SiO ₂浓度的增加，每个PI链与SiO ₂颗粒之间的非键相互作用能增加，键合复合材料中的非键相互作用能高于未键合复合物。王瑜，杨文龙，刘新梅，林佳琪和孙洪国在第1900045条中对此进行了报道。