Microsize Powders of Ni and Cu were prepared by water atomization technique to fabricate metal matrix composites containing various percentages of nanosized boron nitride particles (1, 2, 3, 4, 5 wt. % of BN in a matrix containing (20 wt. %Ni and 80 wt. %Cu). The prepared mixtures were cold compacted under 400 MPa, and sintered for 2 h at 1000 °C in a controlled atmosphere of 3:2 N₂/H₂ gas mixtures. The microstructure and the chemical composition of the prepared powders as well as the consolidated composites were investigated by X-ray diffraction as well as field emission scanning electron microscope (FESEM) equipped with an energy dispersive spectrometer (EDS). The produced Cu and Ni powders have spheroid shape of size less than 100 microns, but the investigated BN has an equiaxed particle shape and particle size of ∼ 500 nm. It has been also observed that BN and Ni particles were homogeneously distributed in the Cu matrix of the present BN/Ni-Cu composites. The density, electrical resistivity, saturation magnetization and hardness of the composites were measured. It was observed that, by increasing BN content, the relative density was decreased, while the saturation magnetization, electrical resistivity and hardness were increased.

通过水雾化技术制备镍和铜的超细粉末，以制备在含有（20％重量的镍的）基质中包含各种百分比的纳米尺寸的氮化硼颗粒（1、2、3、4、5重量％的BN的金属基质复合材料制备的混合物在400 MPa下冷压，并在3：2 N ₂ / H ₂的受控气氛中于1000°C烧结2小时。混合气体。通过X射线衍射以及配备有能量色散光谱仪（EDS）的场发射扫描电子显微镜（FESEM），研究了制备的粉末以及固结的复合材料的微观结构和化学组成。制得的Cu和Ni粉末具有小于100微米的尺寸的球体形状，但是所研究的BN具有等轴的颗粒形状和〜500nm的颗粒尺寸。还已经观察到，BN和Ni颗粒均匀地分布在本发明的BN / Ni-Cu复合材料的Cu基质中。测量了复合材料的密度，电阻率，饱和磁化强度和硬度。观察到，通过增加BN含量，相对密度降低，而饱和磁化强度