Polyaramid is an indispensable high-performance material for its excellent thermal stability and mechanical strength. But its ultra high melting temperature which is higher than its decomposition temperature and the strong solvent resistance makes it difficult to process. In this work, we prepared a new series of soluble polyamides, poly(arylene ether naphthalene amide)s (PENA), by introducing both naphthalene and phenyl ether groups to the main chain of the polyaramid. The relationship between phenyl ether content and properties of PENAs were investigated. These PENAs have good solubility and can be made into strong and tough films by solvent casting method. Among them, poly(mono arylene ether naphthalene amide)PMENA, which contains mono-ether structure in the polymerization unit, shows the best performance with a tensile strength of 118 MPa and an elongation at break of 45%. Furthermore, PMENA also has good and stable dielectric properties with a high permittivity of 4.7, and low dielectric loss of 0.03 at 1 kHz, at room temperature.

聚芳酰胺因其出色的热稳定性和机械强度而成为必不可少的高性能材料。但是，其高于分解温度的超高熔融温度和强的耐溶剂性使其难以加工。在这项工作中，我们通过将萘和苯基醚基团引入到聚芳酰胺的主链中，制备了一系列新的可溶性聚酰胺，聚（亚芳基醚萘酰胺）（PENA）。研究了苯基醚含量与PENAs性能之间的关系。这些PENA具有良好的溶解性，可通过溶剂流延法制成坚固的膜。其中，在聚合单元中含有单醚结构的聚（单亚芳基醚萘酰胺）PMENA，以118 MPa的抗拉强度和45％的断裂伸长率显示出最佳性能。此外，PMENA在室温下还具有良好且稳定的介电性能，介电常数为4.7，介电损耗为1 kHz时的介电损耗低至0.03。