Abstract The effect of Al2O3 nanoparticles addition on melting, microhardness, microstructural, and mechanical properties of multicomponent Sn-3Ag-0.5Cu-0.06Ni-0.01Ge (SACNiGe) solder alloy was investigated. The shear strength of the capacitor assemblies under varying high-temperature environments for different nanocomposites was assessed and the reliability of the joint was determined using Weibull analysis. The SACNiGe solder doped with 0.01 and 0.05 wt% Al2O3 nanoparticles to prepare nanocomposites and tested on the solder joints for their performance and reliability under different thermal conditions. Plain copper and Ni P layer coated substrates were used to investigate the effect of different surface finish on the joint reliability. The addition of ceramic nanoparticles in small amounts did not affect the melting parameters of the solder. In comparison with the bare solder alloy, nanocomposites yielded about 20% increase in tin-climb height and 14% higher microhardness. The dispersion of ceramic nanoparticles in the matrix and presence of Ni and Ge elements in the solder resulted in substantial microstructure refinement and about 24% supression in intermetallic compounds (IMCs) growth at the joint interface. In comparison with the bare Cu substrate, the Ni P coating on the substrate provided a strong diffusion barrier, promoted thin and complex (Cu, Ni)6Sn5 IMC layer formation at the interface, and significantly retarded the IMC growth kinetics under elevated temperature conditions. Under varying thermal conditions, nanoparticles doped solder compositions showed about 20% increase in the joint shear strength value. The reliability of joints improved appreciably with the addition of 0.05 wt% Al2O3 nanoparticles in the solder. Samples with SACNiGe+0.05Al2O3 nanocomposite reflowed on Ni P coating showed about 32% higher reliability than that on the uncoated-copper substrate. The SACNiGe solder joint performance and reliability could be significantly improved by minor weight percent addition of Al2O3 nanoparticles in the presence of Ni P coating on the substrate.

中文翻译：

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Al2O3纳米颗粒掺杂多组分Sn-3.0Ag-0.5Cu-Ni-Ge焊料合金的性能和可靠性

摘要 研究了Al2O3 纳米颗粒的添加对多组分Sn-3Ag-0.5Cu-0.06Ni-0.01Ge (SACNiGe) 焊料合金的熔化、显微硬度、显微组织和力学性能的影响。评估了不同纳米复合材料在不同高温环境下的电容器组件的剪切强度，并使用威布尔分析确定了接头的可靠性。SACNiGe 焊料掺杂 0.01 和 0.05 wt% Al2O3 纳米粒子以制备纳米复合材料，并在焊点上测试其在不同热条件下的性能和可靠性。使用纯铜和镀镍 P 层的基板来研究不同表面光洁度对接头可靠性的影响。添加少量陶瓷纳米颗粒不会影响焊料的熔化参数。与裸焊料合金相比，纳米复合材料的锡跃高度增加了约 20%，显微硬度提高了 14%。陶瓷纳米颗粒在基体中的分散以及焊料中 Ni 和 Ge 元素的存在导致显着的微观结构细化和约 24% 的接头界面金属间化合物 (IMC) 生长抑制。与裸铜基板相比，基板上的 Ni P 涂层提供了强大的扩散屏障，促进了界面处薄而复杂的 (Cu, Ni)6Sn5 IMC 层的形成，并显着延缓了 IMC 在高温条件下的生长动力学。在不同的热条件下，纳米颗粒掺杂的焊料组合物的接头剪切强度值增加了约 20%。通过在焊料中添加 0.05 wt% Al2O3 纳米颗粒，接头的可靠性显着提高。SACNiGe+0.05Al2O3 纳米复合材料在 Ni P 涂层上回流的样品显示出比未涂层铜基板上的可靠性高约 32%。在基材上存在 Ni P 涂层的情况下，通过添加少量重量百分比的 Al2O3 纳米颗粒可以显着提高 SACNiGe 焊点性能和可靠性。