当前位置: X-MOL 学术Heat Mass Transfer › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Metal and dielectric contact heat transfer and enhancement study using finite element approach
Heat and Mass Transfer ( IF 1.7 ) Pub Date : 2020-07-13 , DOI: 10.1007/s00231-020-02910-0
P. G. Siddappa , Andallib Tariq

Thermal contact conductance (TCC) plays a vital role in improving the performance and the service life the electronic devices. As, the solid conduction paths through which the heat as to be dissipated includes multiple metal-metal and metal-dielectric contacts, which offers significant resistance to the rate of heat transfer. There exists a strong need for the estimation of TCC at the interface of metal-metal as well as metal-dielectric contacts. Majority of the studies relies upon experimental estimation, which is found to be expensive and challenging to perform in numerous electronics areas. The present work provides the 3D, finite element based micro contact thermo-mechanical simulation approach for the estimation of TCC between metal-metal and metal-dielectric contacts. The approach is compared against the steady-state experimental results and shows satisfactory agreement. The study has been extended further to analyse the effect of thermal interfacial materials (TIMs), the conductivity of TIMs, the thickness of TIM and load on contact heat transfer rate and TCC of metal-dielectric contacts. Present results have shown, the highest enhancements in contact heat transfer rates and TCC for TIMs with higher thermal conductivity and when the entire mean plane separation is filled with TIM of higher thermal conductivity. Finally, a model of TCC for metal-dielectric contacts has been established. Based on the methodology presented in this work, the design engineer can analyse the thermo-mechanical behaviour of specific pressed contacts under real operating conditions involving varying load, temperature as well as the interstitial materials at the junction.



中文翻译:

金属和电介质接触传热及有限元研究

热接触电导(TCC)在改善电子设备的性能和使用寿命中起着至关重要的作用。As,通过其散发热量的固体传导路径包括多个金属-金属和金属-电介质接触,这对传热速率提供了显着的阻力。迫切需要估算金属-金属以及金属-电介质接触面的TCC。大多数研究依赖于实验估计,发现实验估计昂贵且在众多电子领域中具有挑战性。本工作提供了基于3D,基于有限元的微接触热机械仿真方法,用于估算金属-金属和金属-电介质接触之间的TCC。该方法与稳态实验结果进行了比较,显示出令人满意的一致性。该研究已进一步扩展,以分析热界面材料(TIM),TIM的电导率,TIM的厚度和负载对金属-电介质触点的接触传热速率和TCC的影响。目前的结果表明,对于导热系数更高的TIM,以及在整个平均平面间距中填充导热系数更高的TIM时,接触传热速率和TCC的提高最大。最后,建立了用于金属-电介质接触的TCC模型。根据这项工作中介绍的方法,设计工程师可以分析特定压力触点在实际工作条件下(涉及变化的负载)的热机械行为,

更新日期:2020-09-10
down
wechat
bug