The mechanism of grain structure development for pure Cu and Cu-30Zn with a low stacking fault energy (SFE) during friction stir welding was examined by changing the peak temperatures. Increase in the peak temperature caused the inhibition of discontinuous dynamic recrystallisation (DDRX) owing to the promotion of dynamic recovery. Further, grain refinement occurred dominantly by the frequent annealing twinning. The B/ {112}⟨110⟩ simple shear texture was highly developed without the 45° rotated cube component, which originated from the DDRX. The mechanism for grain structure development, including the DDRX and the annealing twinning was determined by the ratio of peak to the recrystallisation temperature rather than the melting temperature irrespective of the pure Cu and Cu-30Zn with a low SFE.

中文翻译：

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FSW过程中低层错能纯Cu和Cu-30Zn晶粒结构发展机制

通过改变峰值温度，研究了在搅拌摩擦焊过程中纯铜和具有低堆垛层错能 (SFE) 的 Cu-30Zn 的晶粒结构发展机制。由于动态恢复的促进，峰值温度的增加导致了不连续动态再结晶（DDRX）的抑制。此外，晶粒细化主要通过频繁的退火孪晶发生。B/ {112}⟨110⟩ 简单剪切纹理高度发达，没有源自 DDRX 的 45° 旋转立方体组件。晶粒结构发展的机制，包括 DDRX 和退火孪晶，是由峰值与再结晶温度的比值决定的，而不是由熔化温度决定的，而与具有低 SFE 的纯 Cu 和 Cu-30Zn 无关。