当前位置:
X-MOL 学术
›
Int. J. Therm. Sci.
›
论文详情
Our official English website, www.x-mol.net, welcomes your
feedback! (Note: you will need to create a separate account there.)
Jump in the conduction heat flux at the gas/solid interface in micro-channels
International Journal of Thermal Sciences ( IF 4.9 ) Pub Date : 2021-01-01 , DOI: 10.1016/j.ijthermalsci.2020.106599 Dahia Chibouti , Benoît Trouette , Eric Chénier
International Journal of Thermal Sciences ( IF 4.9 ) Pub Date : 2021-01-01 , DOI: 10.1016/j.ijthermalsci.2020.106599 Dahia Chibouti , Benoît Trouette , Eric Chénier
In micro-channel gas flows, velocity slip and temperature jump must be applied at the fluid/solid interface to take the thermodynamic non-equilibrium into account in the vicinity of the wall. In this work, simulations at molecular scale have been carried out and shown a jump in the conduction heat flux, in agreement with the boundary condition proposed by Maslen (1958) in continuum mechanics.
中文翻译:
微通道气固界面传导热通量的跳跃
在微通道气流中,必须在流体/固体界面应用速度滑移和温度跳跃,以考虑壁附近的热力学非平衡。在这项工作中,进行了分子尺度的模拟,并显示了传导热通量的跳跃,这与 Maslen (1958) 在连续介质力学中提出的边界条件一致。
更新日期:2021-01-01
中文翻译:
微通道气固界面传导热通量的跳跃
在微通道气流中,必须在流体/固体界面应用速度滑移和温度跳跃,以考虑壁附近的热力学非平衡。在这项工作中,进行了分子尺度的模拟,并显示了传导热通量的跳跃,这与 Maslen (1958) 在连续介质力学中提出的边界条件一致。