当前位置: X-MOL 学术Int. J. Therm. Sci. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Jump in the conduction heat flux at the gas/solid interface in micro-channels
International Journal of Thermal Sciences ( IF 4.9 ) Pub Date : 2021-01-01 , DOI: 10.1016/j.ijthermalsci.2020.106599
Dahia Chibouti , Benoît Trouette , Eric Chénier

In mi­cro-chan­nel gas flows, ve­loc­ity slip and tem­per­a­ture jump must be ap­plied at the fluid/​solid in­ter­face to take the ther­mo­dy­namic non-equi­lib­rium into ac­count in the vicin­ity of the wall. In this work, sim­u­la­tions at mol­e­c­u­lar scale have been car­ried out and shown a jump in the con­duc­tion heat flux, in agree­ment with the bound­ary con­di­tion pro­posed by Maslen (1958) in con­tin­uum me­chan­ics.

中文翻译:

微通道气固界面传导热通量的跳跃

在微通道气流中,必须在流体/固体界面应用速度滑移和温度跳跃,以考虑壁附近的热力学非平衡。在这项工作中,进行了分子尺度的模拟,并显示了传导热通量的跳跃,这与 Maslen (1958) 在连续介质力学中提出的边界条件一致。
更新日期:2021-01-01
down
wechat
bug