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Form-Stable Erythritol/HDPE Composite Phase Change Material with Flexibility, Tailorability, and High Transition Enthalpy
ACS Applied Polymer Materials ( IF 4.4 ) Pub Date : 2020-09-08 , DOI: 10.1021/acsapm.0c00584
Siyu Chai 1, 2 , Keyan Sun 1, 2 , Donghui Zhao 3 , Yan Kou 1 , Quan Shi 1
Affiliation  

Erythritol has attracted much attention recently in the field of phase change materials (PCMs) for thermal management because of its superior phase-transition properties. However, the liquid-phase leakage and solid-phase rigidity commonly existing in organic PCMs greatly limit its practical application. Herein, we have constructed a form-stable erythritol/high-density polyethylene (HDPE) composite PCM for the first time, in which erythritol serves as a PCM unit and HDPE as a supporting material. The most impressive aspect of this composite PCM is that the supporting material HDPE can also contribute extra transition enthalpy because of its overlapped melting temperature region with that of erythritol, and consequently, the constructed composite PCM exhibits a superior high melting enthalpy of 308.52 J/g. The erythritol/HDPE composite PCM reported in this work may provide a strategy of synthesizing from-stable PCMs with large thermal energy storage density. Moreover, we have further fabricated bulk erythritol/HDPE into a lamellar composite PCM with advanced flexibility and tailorability using a hot-pressing method. This lamellar shape-stable composite PCM is very promising to be utilized in the field of thermal management with a complicated application scenario or special configuration requirements.

中文翻译:

形状稳定的赤藓糖醇/ HDPE复合相变材料,具有灵活性,可定制性和高转变焓

赤藓糖醇由于其出色的相变特性,最近在用于热管理的相变材料(PCM)领域引起了广泛关注。然而,有机PCM中普遍存在的液相泄漏和固相刚度极大地限制了其实际应用。本文中,我们首次构建了形状稳定的赤藓糖醇/高密度聚乙烯(HDPE)复合材料PCM,其中赤藓糖醇用作PCM单元,HDPE作为支撑材料。该复合PCM的最令人印象深刻的方面是,支撑材料HDPE由于其熔融温度区域与赤藓糖醇的交叠温度范围重叠,因此也可以贡献额外的跃迁焓,因此,构建的复合PCM表现出优越的308.52 J / g高熔融焓。 。在这项工作中报道的赤藓糖醇/ HDPE复合PCM可能提供一种合成具有高热能存储密度的不稳定PCM的策略。此外,我们还使用热压方法将松散的赤藓糖醇/ HDPE进一步制成具有先进的柔韧性和可定制性的层状复合材料PCM。这种层状形状稳定的复合材料PCM非常有希望用于具有复杂应用场景或特殊配置要求的热管理领域。
更新日期:2020-11-13
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