Abstract Though various metal powders are used as the main components of conductive pastes, silver is most widely used owing to its high conductivity and strong corrosion resistance. Hence, silver paste is required for the manufacturing of many items, such as large-area display panels and semiconductor chips. However, electrodes made of silver paste commonly have low surface energy levels, resulting in hydrophobicity. To strengthen the adhesive force between films when silver paste is used as a component in items consisting of many film layers, the silver paste must have high surface energy. In other words, it must show low contact angles in water-drop measurements. Despite the proposal and practicality of the plasma treatment method, this method can cause radical damage, and it is undesirable for batch processes. In this study, the surface energy of a silver paste electrode was changed by dipping it into a sulfuric acid solution. A simple but effective controllable method by which to manage the surface energy is demonstrated, which may be useful for the selective control of specific films on large-area substrates in the future.

中文翻译：

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用于表面能控制的银浆电极的化学处理

摘要 尽管各种金属粉末被用作导电膏的主要成分，但银由于其导电性高、耐腐蚀性强而应用最为广泛。因此，许多物品的制造都需要银浆，例如大面积显示面板和半导体芯片。然而，由银浆制成的电极通常具有低表面能水平，导致疏水性。当银浆用作由许多薄膜层组成的物品中的组分时，为了增强薄膜之间的粘合力，银浆必须具有高表面能。换句话说，它必须在水滴测量中显示出低接触角。尽管等离子体处理方法的提议和实用性，但该方法会导致自由基损伤，并且不适合批量处理。在这项研究中，银浆电极的表面能通过将其浸入硫酸溶液中而改变。展示了一种简单但有效的可控方法来管理表面能，这可能有助于未来大面积基板上特定薄膜的选择性控制。