The effect of different fabricating processes (spray forming and conventional casting) and homogenization treatment on the microstructure of an 7055 alloy was investigated by optical microscopy (OM), scanning electron microscopy (SEM), electron probe X-ray micro-analyzer (EPMA), and transmission electron microscopy (TEM). It was found that the grain size of the as-deposited (spray formed) 7055 alloy had half the size as that of the as-cast 7055 alloy and there was no Al₂CuMg phase that embedded in the coarse Mg(Zn, Cu, Al)₂ phase distributed along the grain boundaries in the as-deposited 7055 alloy. No segregation of zirconium was observed in the as-deposited 7055 alloy. After homogenization heating at 350 °C/5 hours + 470 °C/24 hours, Al₃Zr dispersoids were inhomogeneously distributed within grains in the traditionally cast 7055 alloy, while more homogeneously distributed within grains in the spray-formed 7055 alloy. Compared with the traditional cast 7055 alloy, the uniform distribution of Al₃Zr dispersoids in the spray-formed 7055 alloy retards recrystallization more effectively. This investigation highlights the advantage of spray forming technology on improving microstructure of a 7055 alloy.

通过光学显微镜（OM），扫描电子显微镜（SEM），电子探针X射线显微分析仪（EPMA）研究了不同制造工艺（喷涂和常规铸造）和均质化处理对7055合金显微组织的影响。 ，以及透射电子显微镜（TEM）。发现沉积（喷镀）7055合金的晶粒尺寸是铸造7055合金的一半，并且没有Al ₂ CuMg相埋在粗Mg（Zn，Cu， Al）₂相在沉积的7055合金中沿晶界分布。在沉积的7055合金中未观察到锆的偏析。均质后，在350°C / 5小时+ 470°C / 24小时的条件下加热Al ₃Zr弥散体在传统铸造的7055合金中不均匀地分布在晶粒内，而在喷涂成型的7055合金中则更均匀地分布在晶粒内。与传统的铸造7055合金相比，喷涂形成的7055合金中Al ₃ Zr分散质的均匀分布可以更有效地阻止再结晶。这项研究突出了喷射成形技术在改善7055合金显微组织方面的优势。