A low-temperature synthesis of copper conductive film was conducted at the near-decomposition-onset temperature of copper formate-amine complex inks. Amines with a low boiling point (butylamine (b.p. 78 °C), pentylamine (b.p. 104 °C), and hexylamine (b.p. 132 °C)) were mixed with copper formate to prepare the complex inks, followed by calcination at various temperatures. The copper film calcined from copper-pentylamine complex ink showed the lowest level of resistivity. The optimal molar ratio for the conversion of pentylamine to copper formate was set at 2.4. That ratio resulted in a volume resistivity of 5.7 µΩ cm following calcination at 110 °C. The composition of the copper film was dominated by three sizes of nanoparticles, which were generated via a two-step formation of nanoparticles.

在甲酸铜-胺复合油墨的接近分解开始温度下进行铜导电膜的低温合成。将低沸点的胺（丁胺（bp 78°C），戊胺（bp 104°C）和己胺（bp 132°C））与甲酸铜混合制备复合油墨，然后在不同温度下煅烧。由铜-戊胺复合油墨煅烧的铜膜的电阻率最低。将戊胺转化为甲酸铜的最佳摩尔比设定为2.4。该比率导致在110°C下煅烧后的体积电阻率为5.7 µΩ cm。铜膜的组成主要由三种尺寸的纳米颗粒决定，它们是通过两步形成纳米颗粒而生成的。