3D-Network-on-Chips exploit the benefits of Network-on-Chips and 3D-Integrated Circuits allowing them to be considered as one of the most advanced and auspicious communication methodologies. On the other hand, the reliability of 3D-NoCs, due to the vulnerability of Through Silicon Vias, remains a major problem. Most of the existing techniques rely on correcting the TSV defects by using redundancies or employing routing algorithms. Nevertheless, they are not suitable for TSV-cluster defects as they can either lead to costly area and power consumption overheads, or they may result in non-minimal routing paths; thus, posing serious threats to the system reliability and overall performance. In this work, we present a scalable and low-overhead TSV usage and design method for 3D-NoC systems where the TSVs of a router can be utilized by its neighbors to deal with the cluster open defects. An adaptive online algorithm is also introduced to assist the proposed system to immediately work around the newly detected defects without using redundancies. The experimental results show the proposal ensure less than 2 percent of the routers being disabled, even with 50 percent of the TSV clusters defects. The performance evaluations also demonstrate unchanged performances for real applications under 5 percent of cluster defects.

中文翻译：

---

用于高可靠 3D-NoC 系统中 TSV 簇缺陷恢复的可扩展设计方法和在线算法

3D 片上网络利用片上网络和 3D 集成电路的优势，使它们被视为最先进和最吉祥的通信方法之一。另一方面，由于硅通孔的脆弱性，3D-NoC 的可靠性仍然是一个主要问题。大多数现有技术依赖于通过使用冗余或采用路由算法来纠正 TSV 缺陷。然而，它们不适合 TSV 集群缺陷，因为它们可能导致昂贵的面积和功耗开销，或者可能导致非最小路由路径；从而对系统的可靠性和整体性能构成严重威胁。在这项工作中，我们提出了一种用于 3D-NoC 系统的可扩展且低开销的 TSV 使用和设计方法，其中路由器的 TSV 可以被其邻居利用来处理集群开放缺陷。还引入了自适应在线算法，以帮助所提出的系统立即解决新检测到的缺陷，而无需使用冗余。实验结果表明，即使存在 50% 的 TSV 集群缺陷，该提议也确保了不到 2% 的路由器被禁用。性能评估还表明，在 5% 的集群缺陷下，实际应用的性能保持不变。实验结果表明，即使存在 50% 的 TSV 集群缺陷，该提议也确保了不到 2% 的路由器被禁用。性能评估还表明，在 5% 的集群缺陷下，实际应用的性能保持不变。实验结果表明，即使存在 50% 的 TSV 集群缺陷，该提议也确保了不到 2% 的路由器被禁用。性能评估还表明，在 5% 的集群缺陷下，实际应用的性能保持不变。