In this research, the return path discontinuity (RPD), located under the power amplifier (PA) substrate, of X-band transceiver module (Base), mounted on a four-layer printed circuit board (PCB), is investigated to improve the signal integrity by reducing the difference in the reference potential. This study is performed by initially employing the wirebond method, through the assessment of both numbers and sizes of bondwires by advanced design system (ADS). Six bondwires of 25 µm are added, producing an improvement of 6.82 dB for the reflection coefficient and 1.19 dB for the isolation and insertion loss. For further improvement, spiral shape defected ground structure (DGS) is implemented in the inner ground layer (layer 2) without using bond wires. The DGS simulation results illustrate an improvement of 3 dB for S ₁₁ and 0.6 dB for S ₁₂ . To improve the electromagnetic compatibility (EMC), the authors propose combination and integration of both wirebond and DGS methods, called wirebond–DGS method, which results in an improvement of 11.86 dB for S ₁₁ , 1.34 dB for S ₁₂ and S ₂₁ , and 12.03 dB for S ₂₂ . Finally, the wirebond–DGS RF module was fabricated and the measurement results exhibit an improvement of 8.07 dB for S ₁₁ and 9.39 dB for S ₂₂ in comparison with the fabricated Base module. In addition, 0.53 dB improvement for both S ₁₂ and S ₂₁ is also achieved.

中文翻译：

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用于混合信号收发器模块的EMC改进的缺陷接地结构的分析和设计

在这项研究中，研究了安装在四层印刷电路板（PCB）上的X波段收发器模块（Base）的功率放大器（PA）基板下方的返回路径不连续性（RPD），通过减小基准电位差来实现信号完整性。这项研究首先通过采用引线键合方法进行，然后通过高级设计系统（ADS）评估键合线的数量和尺寸。添加了6条25 µm的键合线，使反射系数提高了6.82 dB，隔离和插入损耗提高了1.19 dB。为了进一步改进，在内部接地层（第2层）中实现了螺旋形缺陷接地结构（DGS），而无需使用接合线。DGS仿真结果表明，对于小号 ₁₁和0.6 dB小号 ₁₂ 。为了提高电磁兼容性（EMC），作者建议将引线键合和DGS方法（即wirebond–DGS方法）进行组合和集成，从而可以将电磁键合改善11.86 dB。小号 ₁₁ ，对于1.34分贝小号 ₁₂和小号 ₂₁ 和12.03 dB小号 ₂₂ 。最后，制造了引线键合-DGS RF模块，测量结果表明，对于小号 ₁₁和9.39 dB小号 与制造的基本模块相比为₂₂。此外，两者均提高了0.53 dB小号 ₁₂和小号 也达到了₂₁。