The development of ball grid array (BGA) packages, such as the chip scale package, wafer level package and package on package, has focused on creating electronics packages that are smaller, thinner, higher-performance and capable of higher functionality, among other desirable traits. Among the interconnection materials used in BGA packages, the Cu-core solder ball (CCSB) has many advantages, such as the use of finer pitch, improved electrical conductivity and better controllability of the coplanarity of the chip. In this study, we evaluated the mechanical properties of the CCSB and Sn-3.0Ag-0.5Cu (SAC) by low-speed shear tests, and the von Mises stress distribution and plastic strain distribution were simulated using a finite element method. The diameter of each solder ball was 280 μm, and the outer layer of the CCSB was a plated SAC layer. The shear strength of the CCSB was about 10% greater than that of SAC. The maximum value of the simulated von Mises stress for the CCSB was higher than that of SAC because the Cu-core is stiffer than SAC. The fracture energy of the CCSB decreased by about 50% compared to that of SAC. The maximum value of simulated plastic strain, which is associated with fracture surfaces, was higher with the CCSB than with SAC. We can thus conclude that the Cu-core in the CCSB affects the shear strength and fracture behavior of solder joints.

球栅阵列（BGA）封装（例如芯片级封装，晶圆级封装和封装上封装）的开发集中于创建更小，更薄，性能更高且能够实现更高功能的电子封装。特质。在BGA封装中使用的互连材料中，铜芯焊球（CCSB）具有许多优点，例如使用更细的间距，改善的电导率和更好的芯片共面性可控性。在这项研究中，我们通过低速剪切试验评估了CCSB和Sn-3.0Ag-0.5Cu（SAC）的力学性能，并使用有限元方法模拟了von Mises应力分布和塑性应变分布。每个焊球的直径是280μm，并且CCSB的外层是镀的SAC层。CCSB的剪切强度比SAC的剪切强度高约10％。CCSB的模拟冯·米塞斯应力的最大值高于SAC的最大值，因为Cu核比SAC坚硬。与SAC相比，CCSB的断裂能降低了约50％。CCSB的模拟塑性应变最大值（与断裂表面相关）高于SAC。因此，我们可以得出结论，CCSB中的铜芯会影响焊点的剪切强度和断裂行为。CCSB的应力与裂缝表面的应力有关，比SAC的应力高。因此，我们可以得出结论，CCSB中的铜芯会影响焊点的剪切强度和断裂行为。CCSB的应力与裂缝表面的应力有关，比SAC的应力高。因此，我们可以得出结论，CCSB中的铜芯会影响焊点的剪切强度和断裂行为。