Interfacial electron transfer within the electrode is crucial for various electrocatalytic reactions. Herein, we demonstrated that in-situ grown Cu2O on Cu foam as a scaffold to load active ingredients could lower the interfacial contact resistance and promote the electron transfer in oxygen evolution reaction. Meanwhile, the Cu2O/Cu (CCF) facilitates to load active components due to higher surface area resulting from its irregular scattered structure. As a demonstration, Ni–Fe doubles layered hydroxide (NiFe-LDH) coated carbon nanotube spheroidal particles (CNS@NiFe) was anchored by a drop-casting route to assemble CNS@NiFe/CCF hybrid electrodes with the CCF as scaffolds. The CNS@NiFe/CCF electrode afforded an ultralow overpotential of 248 mV at 10 mA cm−2 and a small Tafel slope of 32.9 mV dec−1 with an excellent stability. Schematic illustration of CNS@NiFe/CCF architecture.

中文翻译：

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通过将 NiFe-LDH 锚定在原位生长的 Cu2O 上来调节界面电子转移以增强氧气释放

电极内的界面电子转移对于各种电催化反应至关重要。在此，我们证明了在 Cu 泡沫上原位生长的 Cu2O 作为负载活性成分的支架可以降低界面接触电阻并促进析氧反应中的电子转移。同时，Cu2O/Cu（CCF）由于其不规则的散射结构导致更大的表面积，有利于负载活性成分。作为演示，Ni-Fe 双层氢氧化物 (NiFe-LDH) 涂覆的碳纳米管球状颗粒 (CNS@NiFe) 通过滴铸路线锚定，以 CCF 作为支架组装 CNS@NiFe/CCF 混合电极。CNS@NiFe/CCF 电极在 10 mA cm-2 下提供了 248 mV 的超低过电位和 32.9 mV dec-1 的小塔菲尔斜率，并具有出色的稳定性。