Abstract With the rapidly growing power density of integrated circuits in modern electronic devices, how to construct efficient thermal conductive network achieving advanced heat conduction materials has attracted widespread attention. In this work, at an extremely low content of carbon nanotubes (CNTs), a synergistic hybrid structure of bridged boron nitride nanosheets (BNNSs) by CNTs was constructed along the polyvinyl alcohol (PVA) fibers by electrospinning, and simply resin transfer molding method was employed to produce Epoxy/PVA (BNNSs/CNTs) composite film. Fabricated Epoxy/PVA (BNNSs/CNTs) composite film not only presented great in-plane thermal conductivity (TC) 6.3 W/m·K at total filler loading of 27.5 wt%, higher than that of Epoxy/PVA (BNNSs) composite film without CNTs by 88%, but also exhibited excellent electrical insulating properties (6 × 10−13 S/cm). During the heating and cooling test, infrared thermal images showed that the synergistic hybrid composite has the highest surface temperature and the best heat dissipation capacity compared to other samples. The great TC enhancement is due to the bridging BNNSs by CNTs reducing interfacial thermal resistance between neighboring fillers. Additionally, good mechanical properties and stable TC provide more immense potential for the wide application of new generated flexible thermal management materials.

中文翻译：

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通过静电纺丝将氮化硼纳米片与定向碳纳米管桥接以制备导热性增强的柔性纳米复合材料

摘要 随着现代电子器件中集成电路功率密度的快速增长，如何构建高效的导热网络以实现先进的导热材料已引起广泛关注。在这项工作中，在极低的碳纳米管 (CNTs) 含量下，通过静电纺丝沿着聚乙烯醇 (PVA) 纤维构建了 CNTs 的桥连氮化硼纳米片 (BNNSs) 的协同混合结构，并采用简单的树脂传递成型方法用于生产环氧树脂/PVA（BNNSs/CNTs）复合薄膜。制备的 Epoxy/PVA (BNNSs/CNTs) 复合膜不仅在总填料量为 27.5 wt% 的情况下表现出良好的面内热导率 (TC) 6.3 W/m·K，高于 Epoxy/PVA (BNNSs) 复合膜88% 没有碳纳米管，但也表现出优异的电绝缘性能（6 × 10-13 S/cm）。在加热和冷却测试过程中，红外热图像显示协同混合复合材料与其他样品相比具有最高的表面温度和最佳的散热能力。巨大的 TC 增强是由于碳纳米管桥接 BNNS 降低了相邻填料之间的界面热阻。此外，良好的机械性能和稳定的 TC 为新型柔性热管理材料的广泛应用提供了更大的潜力。巨大的 TC 增强是由于碳纳米管桥接 BNNS 降低了相邻填料之间的界面热阻。此外，良好的机械性能和稳定的 TC 为新型柔性热管理材料的广泛应用提供了更大的潜力。巨大的 TC 增强是由于碳纳米管桥接 BNNS 降低了相邻填料之间的界面热阻。此外，良好的机械性能和稳定的 TC 为新型柔性热管理材料的广泛应用提供了更大的潜力。