Abstract

The effect of Sn9Zn–xSiC composite solder on the wetting and soldering behavior of 6061 aluminum alloys is investigated using a kind of new water-soluble organic flux through optical and electron microscopy, X-ray diffraction and X-ray photoelectron spectroscopy. The oxide film of 6061 aluminum alloys during the soldering process is composed of three-layer structure of different components, which are followed MgAl₂O₄, Al₂O₃ and Al from the outside to the inside. The flux removes the oxide film by the dissolution reaction. A solid solution layer can be developed by undergoing displacement reaction with the Al-rich phase. With the increasement of SiC micron particle content, the spreading area of the composite solders increases firstly and then decreases. When the weight percentage of SiC micro-particles in the composite solder was 0.75%, the spreading area reached the maximum value, which increased by 38.9% compared with Sn9Zn–0.25SiC composite solder.

Graphic Abstract

中文翻译：

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活化有机水溶性助焊剂在6061铝合金上的氧化膜去除和Sn9Zn-xSiC复合焊料的润湿行为

摘要

通过一种新型的水溶性有机助焊剂，通过光学和电子显微镜，X射线衍射和X射线光电子能谱研究了Sn9Zn–xSiC复合焊料对6061铝合金润湿和焊接行为的影响。6061铝合金在焊接过程中的氧化膜由不同成分的三层结构组成，其后依次是MgAl ₂ O ₄，Al ₂ O ₃和铝从外到内。助焊剂通过溶解反应去除氧化膜。通过与富Al相进行置换反应，可以形成固溶体层。随着SiC微粒含量的增加，复合焊料的散布面积先增大然后减小。当复合焊料中SiC微粒的重量百分比为0.75％时，扩展面积达到最大值，与Sn9Zn–0.25SiC复合焊料相比，扩展面积增加了38.9％。

图形摘要