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Shape Optimization for a Single Valve Vacuum Chuck Using Two-Way FSI Analysis
International Journal of Precision Engineering and Manufacturing ( IF 2.6 ) Pub Date : 2020-08-28 , DOI: 10.1007/s12541-020-00406-9
Dae-Hwan Moon , Seog-Young Han

This study aims to optimize the inner shape of a single valve vacuum chuck to prevent flexible film from wrinkling and shorten the inspect time. Hence, this study developed a two-way fluid–structure interaction (FSI) analysis between the film and its surrounding airflow to simulate film adsorption in a porous ceramic on a single vacuum chuck. Next, the team optimized airflow velocity for the film to achieve the quickest adsorption of the porous ceramic sample in the shortest time. Finally, the vacuum chuck shape was optimized using the optimum airflow velocity profile. The Darcy–Forchheimer and Mooney–Rivlin equations were simulated to calculate the airflow through the porous ceramic and the hyper-elastic material, respectively. The B-spline curve was used to optimize the inner shape of the vacuum chuck. Adsorption tests of single- and multiple-valve vacuum chucks with optimized internal shapes were performed to verify the validity of the simulation results and compare the performance. The optimized vacuum chuck prevented film wrinkling, and the inspection time was reduced by 66% compared to the conventional multiple-valve vacuum chuck. The error between the simulation and the experimental results was within 2.5%. The techniques of the developed two-way FSI analysis and the vacuum chuck shape optimization will greatly contribute to the display and semiconductor industries.



中文翻译:

使用双向FSI分析的单阀真空吸盘形状优化

这项研究旨在优化单阀真空吸盘的内部形状,以防止柔性膜起皱并缩短检查时间。因此,这项研究开发了一种在薄膜及其周围气流之间的双向流体-结构相互作用(FSI)分析,以模拟薄膜在单个真空吸盘上在多孔陶瓷中的吸附。接下来,研究小组优化了薄膜的气流速度,以在最短的时间内实现多孔陶瓷样品的最快吸附。最后,使用最佳气流速度曲线优化了真空吸盘的形状。模拟了Darcy-Forchheimer和Mooney-Rivlin方程,分别计算了通过多孔陶瓷和超弹性材料的气流。B样条曲线用于优化真空吸盘的内部形状。进行了具有优化内部形状的单阀和多阀真空卡盘的吸附测试,以验证模拟结果的有效性并比较性能。优化的真空吸盘可防止薄膜起皱,与传统的多阀真空吸盘相比,检查时间减少了66%。模拟与实验结果之间的误差在2.5%以内。发达的双向FSI分析技术和真空吸盘形状优化技术将极大地促进显示和半导体行业的发展。与传统的多阀真空卡盘相比,检查时间减少了66%。模拟与实验结果之间的误差在2.5%以内。发达的双向FSI分析技术和真空吸盘形状优化技术将极大地促进显示和半导体行业的发展。与传统的多阀真空吸盘相比,检查时间减少了66%。模拟与实验结果之间的误差在2.5%以内。发达的双向FSI分析技术和真空吸盘形状优化技术将极大地促进显示和半导体行业的发展。

更新日期:2020-08-28
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