Stabilization of Sn Anode through Structural Reconstruction of a Cu-Sn Intermetallic Coating Layer.,Advanced Materials

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Stabilization of Sn Anode through Structural Reconstruction of a Cu-Sn Intermetallic Coating Layer.
Advanced Materials ( IF 27.4 ) Pub Date : 2020-08-25 , DOI: 10.1002/adma.202003684
Guanzhi Wang _{1,

2} , Megan Aubin _{2,

3} , Abhishek Mehta _{2,

3} , Huajun Tian ₁ , Jinfa Chang ₁ , Akihiro Kushima _{1,

2,

3} , Yongho Sohn _{2,

3} , Yang Yang _{1,

2,

4}

Affiliation

The metallic tin (Sn) anode is a promising candidate for next‐generation lithium‐ion batteries (LIBs) due to its high theoretical capacity and electrical conductivity. However, Sn suffers from severe mechanical degradation caused by large volume changes during lithiation/delithiation, which leads to a rapid capacity decay for LIBs application. Herein, a Cu–Sn (e.g., Cu₃Sn) intermetallic coating layer (ICL) is rationally designed to stabilize Sn through a structural reconstruction mechanism. The low activity of the Cu–Sn ICL against lithiation/delithiation enables the gradual separation of the metallic Cu phase from the Cu–Sn ICL, which provides a regulatable and appropriate distribution of Cu to buffer volume change of Sn anode. Concurrently, the homogeneous distribution of the separated Sn together with Cu promotes uniform lithiation/delithiation, mitigating the internal stress. In addition, the residual rigid Cu–Sn intermetallic shows terrific mechanical integrity that resists the plastic deformation during the lithiation/delithiation. As a result, the Sn anode enhanced by the Cu–Sn ICL shows a significant improvement in cycling stability with a dramatically reduced capacity decay rate of 0.03% per cycle for 1000 cycles. The structural reconstruction mechanism in this work shines a light on new materials and structural design that can stabilize high‐performance and high‐volume‐change electrodes for rechargeable batteries and beyond.

中文翻译：

通过铜-锡金属间镀层的结构重建来稳定锡阳极。

金属锡（Sn）阳极具有很高的理论容量和导电性，因此是下一代锂离子电池（LIB）的有希望的候选者。然而，锡由于在锂化/脱锂期间的大体积变化而导致严重的机械劣化，这导致LIB应用的容量快速下降。此处，Cu–Sn（例如，Cu ₃Sn）金属间涂层（ICL）经过合理设计，可通过结构重建机制稳定Sn。Cu-Sn ICL对锂化/脱锂的低活性使金属Cu相与Cu-Sn ICL逐渐分离，从而提供可调节且适当的Cu分布以缓冲Sn阳极的体积变化。同时，分离的Sn与Cu的均匀分布促进了均匀的锂化/去锂化，从而减轻了内部应力。另外，残余的刚性的Cu-Sn金属间化合物显示出极好的机械完整性，可抵抗锂化/脱锂过程中的塑性变形。结果，通过Cu-Sn ICL增强的Sn阳极显示出循环稳定性的显着改善，容量衰减率为0。1000次循环，每个循环03％。这项工作中的结构重建机制为新材料和结构设计提供了亮点，它们可以稳定可充电电池及其以外的高性能和大容量更换电极。

更新日期：2020-10-20

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