With an increasingly complex working environment and the growing demand in the electrical equipment market, the performance of high-frequency printed circuit boards (PCBs) is generally inadequate, and this problem is due to the failure of either its material or internal architecture. Thus, state-of-the-art PCBs with robust mechanical performance and a low dielectric constant need to be developed. This study proposes a facile technique to fabricate PCBs by assembling aramid fiber (AF) and polyphenylene sulfide (PPS) by combining papermaking and thermocompression lamination. A PPS nonwoven fabric and AFs were first introduced into deionized water and then subjected to intense shearing to form hybrid paper. AF/PPS composite laminates were then fabricated by thermocompression. The as-prepared AF/PPS-30 wt% sample exhibited a flexural strength of 181.4 MPa and a flexural modulus of 13.1 GPa. The sample also achieved a dielectric constant of 3.3 at 15 kHz to 2 MHz, suggesting that the sample exhibited superior dielectric performance and frequency independency as a high-frequency function attributable to the controllable aramid network structure. The dielectric constants of one-dimensional materials reinforced polymer composites were also studied theoretically, and the results presented using the Bruggeman model were consistent with the experimental values. This study provides a feasible strategy for the fabrication of extraordinary PCBs to achieve both desirable mechanical performance and low dielectric constant.

随着工作环境的日益复杂和电气设备市场需求的增长，高频印刷电路板（PCB）的性能通常不足，并且此问题是由于其材料或内部架构的故障而引起的。因此，需要开发出具有鲁棒机械性能和低介电常数的最新PCB。这项研究提出了一种通过结合造纸和热压层压来组装芳纶纤维（AF）和聚苯硫醚（PPS）来制造PCB的简便技术。首先将PPS无纺布和AF引入去离子水中，然后进行强力剪切以形成混合纸。然后通过热压法制备AF / PPS复合层压板。所制备的AF / PPS-30 wt％样品的弯曲强度为181。4 MPa，弯曲模量为13.1 GPa。该样品在15 kHz至2 MHz时的介电常数也达到3.3，这表明该样品表现出优异的介电性能和频率独立性，这是归因于可控制的芳族聚酰胺网络结构的高频功能。对一维材料增强的聚合物复合材料的介电常数进行了理论研究，Bruggeman模型的计算结果与实验值吻合。这项研究为制造非凡的PCB提供了可行的策略，以实现理想的机械性能和低介电常数。这表明样品表现出优异的介电性能和频率独立性，这是归因于可控芳族聚酰胺网络结构的高频功能。对一维材料增强的聚合物复合材料的介电常数进行了理论研究，Bruggeman模型的计算结果与实验值吻合。这项研究为制造非凡的PCB提供了可行的策略，以实现理想的机械性能和低介电常数。这表明样品表现出优异的介电性能和频率独立性，这是归因于可控芳族聚酰胺网络结构的高频功能。对一维材料增强的聚合物复合材料的介电常数进行了理论研究，Bruggeman模型的计算结果与实验值吻合。这项研究为制造非凡的PCB提供了可行的策略，以实现理想的机械性能和低介电常数。Bruggeman模型给出的结果与实验值一致。这项研究为制造非凡的PCB提供了可行的策略，以实现理想的机械性能和低介电常数。Bruggeman模型给出的结果与实验值一致。这项研究为制造非凡的PCB提供了可行的策略，以实现理想的机械性能和低介电常数。