Correlating the electrical performance of photovoltaic modules to the spatially resolved photoluminescence, electroluminescence, and dark lock-in thermography (DLIT) images is an important long-term goal for developing solar cell technology. These images offer highly sophisticated and detailed information about the spatial distribution and (if imaged at successive time intervals) temporal degradation of local series and shunt resistances. There have been extensive studies to correlate these imaging techniques to local characteristics at the cell level. However, it has been difficult to extract and quantify module-level information from the techniques. In this study, we interpret module current-voltage (I-V) measurements along with corresponding DLIT images within a module-scale simulation framework, demonstrating that series resistance degradation of the module I-V characteristics, in this case, can be attributed to solder bond failures. Our simulations highlight how current crowding associated with a failed solder joint (or a section of the solder pad) translates to the characteristic point-like (asymmetric doublet) heating pattern in neighboring solder joints (or the neighboring regions of the solder pad). The correlation between series resistance and solder joint degradation could inform expedited diagnosis of field degradation of solar modules.

中文翻译：

---

暗锁定热成像将焊点失效确定为现场太阳能模块串联电阻增加的根本原因

将光伏模块的电气性能与空间分辨光致发光、电致发光和暗锁定热成像 (DLIT) 图像相关联是开发太阳能电池技术的重要长期目标。这些图像提供了关于空间分布和（如果以连续时间间隔成像）局部串联和分流电阻的时间退化的高度复杂和详细的信息。已经有大量研究将这些成像技术与细胞水平的局部特征相关联。然而，很难从这些技术中提取和量化模块级信息。在这项研究中，我们解释了模块电流电压 (IV) 测量值以及模块规模模拟框架内的相应 DLIT 图像，证明模块 IV 特性的串联电阻退化，在这种情况下，可归因于焊接失败。我们的模拟强调了与故障焊点（或焊盘的一部分）相关的电流拥挤如何转化为相邻焊点（或焊盘的相邻区域）中的特征点状（不对称双峰）加热模式。串联电阻和焊点退化之间的相关性可以为太阳能模块的现场退化的快速诊断提供信息。我们的模拟强调了与故障焊点（或焊盘的一部分）相关的电流拥挤如何转化为相邻焊点（或焊盘的相邻区域）中的特征点状（不对称双峰）加热模式。串联电阻和焊点退化之间的相关性可以为太阳能模块的现场退化的快速诊断提供信息。我们的模拟强调了与故障焊点（或焊盘的一部分）相关的电流拥挤如何转化为相邻焊点（或焊盘的相邻区域）中的特征点状（不对称双峰）加热模式。串联电阻和焊点退化之间的相关性可以为太阳能模块的现场退化的快速诊断提供信息。