Abstract Hotspots have become one of the most limiting factors in the conception of more and more performing electronic chips. Although many wicking materials are used as porous media in used as porous media in flat plate heat pipe (FHP), copper metal foams are not well studied with these devices. In the present study, a three-dimensional FHPs with multi heat sources is investigated numerically using COMSOL Multiphysics. The potential use of copper metal foam as a wick structure is investigated. The effect of heat flux, as well as hotspot positions on heat pipe performance, is analyzed and results show that copper metal foam can be an alternative wick used for FHPs. Visualization is made taking into account the hot spot position effect at different heat flux. Results show that top hot spot positions especially close to the wall are the most critical locations where dry out can occur. Hot spot dimensions, as well as their distances and effective pore radius, have a significant effect on heat pipe operation.

中文翻译：

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用于电子冷却应用的热点铜金属泡沫扁平热管的 CFD 分析

摘要 热点已成为越来越多的高性能电子芯片概念的最大限制因素之一。尽管在平板热管 (FHP) 中用作多孔介质时，许多芯吸材料被用作多孔介质，但使用这些设备并未很好地研究铜金属泡沫。在本研究中，使用 COMSOL Multiphysics 对具有多热源的三维 FHP 进行了数值研究。研究了铜金属泡沫作为灯芯结构的潜在用途。分析了热通量以及热点位置对热管性能的影响，结果表明铜金属泡沫可以作为用于 FHP 的替代灯芯。可视化考虑了不同热通量下的热点位置效应。结果表明，特别靠近墙壁的顶部热点位置是可能发生干涸的最关键位置。热点尺寸，以及它们的距离和有效孔隙半径，对热管运行有显着影响。