In this work, on-chip chalcogenide glass photonic integrations with several fundamental photonic building blocks are designed and fabricated based on the ${\mathrm{As}}_2{\mathrm{S}}_3$ platform for improved 2 μm optical interconnection, achieving a broadened wavelength bandwidth and improved fabrication tolerance. A 600 nm thick ${\mathrm{As}}_2{\mathrm{S}}_3$ strip waveguide has low propagation loss of 1.447 dB/cm at 2 μm. Broadband vertical coupling is realized by a grating coupler with 4.3 dB coupling loss. A Bragg grating filter, power splitter, Mach–Zander interferometer, and mode converter for on-chip mode division multiplexing (MDM) are also reported at 2 μm with reliable performances. Finally, a record high MDM optical interconnection capacity of $3\times 80\mathrm{Gbps}$ at 2 μm is experimentally demonstrated based on the proposed ${\mathrm{As}}_2{\mathrm{S}}_3$ chip, drawing promising prospects for future photonic integration and high-speed interconnection at the 2 μm waveband.

中文翻译：

---

硫族化物玻璃光子集成可改善2μm的光学互连

在这项工作中，基于以下原理设计和制造了具有几个基本光子构建块的片上硫族化物玻璃光子集成。 ${如}_2{\mathrm{小号}}_3$用于改善2μm光学互连的平台，实现了更宽的波长带宽和更高的制造公差。600纳米厚${如}_2{\mathrm{小号}}_3$条形波导在2μm处具有1.447 dB / cm的低传播损耗。宽带垂直耦合是通过具有4.3 dB耦合损耗的光栅耦合器实现的。据报道，用于片上模式分割多路复用（MDM）的布拉格光栅滤波器，功率分配器，马赫-曾德尔干涉仪和模式转换器均具有2μm的性能，并且性能可靠。最后，MDM的光互连容量达到了历史最高$3\times 80\mathrm{千兆位}$ 根据建议，通过实验证明了2μm ${如}_2{\mathrm{小号}}_3$ 芯片，为未来的2μm波段光子集成和高速互连带来了广阔的前景。