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Highly Thermally Stable, Green Solvent Disintegrable, and Recyclable Polymer Substrates for Flexible Electronics.
Macromolecular Rapid Communications ( IF 4.2 ) Pub Date : 2020-08-24 , DOI: 10.1002/marc.202000292 Linlin Chen 1 , Huang Yu 1 , Mahmut Dirican 2 , Dongjun Fang 1 , Yan Tian 1 , Chaoyi Yan 2 , Jingyi Xie 1 , Dongmei Jia 1 , Hao Liu 1 , Jiasheng Wang 3 , Fangcheng Tang 3 , Xiangwu Zhang 2 , Jinsong Tao 1
Macromolecular Rapid Communications ( IF 4.2 ) Pub Date : 2020-08-24 , DOI: 10.1002/marc.202000292 Linlin Chen 1 , Huang Yu 1 , Mahmut Dirican 2 , Dongjun Fang 1 , Yan Tian 1 , Chaoyi Yan 2 , Jingyi Xie 1 , Dongmei Jia 1 , Hao Liu 1 , Jiasheng Wang 3 , Fangcheng Tang 3 , Xiangwu Zhang 2 , Jinsong Tao 1
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Flexible electronics require its substrate to have adequate thermal stability, but current thermally stable polymer substrates are difficult to be disintegrated and recycled; hence, generate enormous electronic solid waste. Here, a thermally stable and green solvent‐disintegrable polymer substrate is developed for flexible electronics to promote their recyclability and reduce solid waste generation. Thanks to the proper design of rigid backbones and rational adjustments of polar and bulky side groups, the polymer substrate exhibits excellent thermal and mechanical properties with thermal decomposition temperature (Td,5%) of 430 °C, upper operating temperature of over 300 °C, coefficient of thermal expansion of 48 ppm K−1, tensile strength of 103 MPa, and elastic modulus of 2.49 GPa. Furthermore, the substrate illustrates outstanding optical and dielectric properties with high transmittance of 91% and a low dielectric constant of 2.30. Additionally, it demonstrates remarkable chemical and flame resistance. A proof‐of‐concept flexible printed circuit device is fabricated with this substrate, which demonstrates outstanding mechanical–electrical stability. Most importantly, the substrate can be quickly disintegrated and recycled with alcohol. With outstanding thermally stable properties, accompanied by excellent recyclability, the substrate is particularly attractive for a wide range of electronics to reduce solid waste generation, and head toward flexible and “green” electronics.
中文翻译：
用于柔性电子的高度热稳定，绿色溶剂可崩解和可回收的聚合物基材。
柔性电子产品要求其基材具有足够的热稳定性，但是目前热稳定的聚合物基材难以分解和回收；因此，会产生巨大的电子固体废物。在此，为柔性电子产品开发了一种热稳定且绿色环保的可分解溶剂的聚合物基材，以提高其可回收性并减少固体废物的产生。得益于刚性骨架的合理设计以及极性和庞大侧基的合理调整，聚合物基材具有出色的热和机械性能，热分解温度（T d，5％）为430°C，最高工作温度超过300° C，热膨胀系数为48 ppm K -1，抗拉强度为103 MPa，弹性模量为2.49 GPa。此外，该基材还具有出色的光学和介电性能，具有91％的高透射率和2.30的低介电常数。此外，它还具有出色的耐化学性和阻燃性。使用该基板制造了概念验证的柔性印刷电路设备，该电路具有出色的机械电气稳定性。最重要的是，底物可以快速崩解并用酒精再循环。凭借出色的热稳定性能以及出色的可回收性，该基材特别适用于各种电子产品，以减少固体废物的产生，并朝着灵活而“绿色”的电子产品发展。
更新日期：2020-10-05
中文翻译：
用于柔性电子的高度热稳定，绿色溶剂可崩解和可回收的聚合物基材。
柔性电子产品要求其基材具有足够的热稳定性，但是目前热稳定的聚合物基材难以分解和回收；因此，会产生巨大的电子固体废物。在此，为柔性电子产品开发了一种热稳定且绿色环保的可分解溶剂的聚合物基材，以提高其可回收性并减少固体废物的产生。得益于刚性骨架的合理设计以及极性和庞大侧基的合理调整，聚合物基材具有出色的热和机械性能，热分解温度（T d，5％）为430°C，最高工作温度超过300° C，热膨胀系数为48 ppm K -1，抗拉强度为103 MPa，弹性模量为2.49 GPa。此外，该基材还具有出色的光学和介电性能，具有91％的高透射率和2.30的低介电常数。此外，它还具有出色的耐化学性和阻燃性。使用该基板制造了概念验证的柔性印刷电路设备，该电路具有出色的机械电气稳定性。最重要的是，底物可以快速崩解并用酒精再循环。凭借出色的热稳定性能以及出色的可回收性，该基材特别适用于各种电子产品，以减少固体废物的产生，并朝着灵活而“绿色”的电子产品发展。
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