This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and grounded coplanar waveguide (GCPW) transmission lines are also designed and tested to investigate line losses at D-band. The test structures are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measurement results indicate an insertion loss of 1.9 dB/cm for the microstrip line and 1.8 dB/cm for the coplanar waveguide at 150 GHz. The measured maximum gains for single antenna and 16-element array are respectively 7 dBi and 14 dBi at 143 GHz. The measured antenna input matching bandwidth is 20 GHz. The results show the viability of advanced printed circuit technology for D-band transmission lines, antennas, and antenna arrays.

中文翻译：

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用于D波段的多层高频PCB上的贴片天线和天线阵列

本文介绍了针对D波段应用的宽带腔背衬孔耦合贴片天线和多层印刷电路板（PCB）上的16元素天线阵列的设计，制造和特性。还设计并测试了微带线和接地共面波导（GCPW）传输线，以研究D波段的线损耗。测试结构使用印刷电路板技术制造，并在多层基板上进行导体的半加成处理（mSAP）。测量结果表明，在150 GHz时，微带线的插入损耗为1.9 dB / cm，共面波导的插入损耗为1.8 dB / cm。在143 GHz频率下，单天线和16元素阵列的最大测量增益分别为7 dBi和14 dBi。测得的天线输入匹配带宽为20 GHz。