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Enhanced Dielectric Properties of Poly(dimethyl siloxane) Bimodal Network Percolative Composite with Chemically Modified Graphene
Polymer Testing ( IF 5.0 ) Pub Date : 2020-11-01 , DOI: 10.1016/j.polymertesting.2020.106824
Lei Wei , Jing-Wen Wang , Xin-Hua Gao , Hou-Qing Wang , Xin-Zhu Wang , Hua Ren

Abstract Bimodal network composite was prepared using a two-step method containing graphene modified by γ-(2, 3-epoxypropoxy) propyl trimethoxysilane (KH560), short chain poly(dimethyl siloxane) (CS-PDMS) and long chain poly(dimethyl siloxane) filled with treated fumed silica (CL-h-PDMS). A series of composites with different filler contents (including reduced graphene oxide and reduced graphene oxide grafted with KH560, referred to rGO and KrGO, respectively) were prepared to explore their percolation thresholds (fc). We discover that the dielectric constant and loss of 1.32 vol.% KrGO/h-PDMS composite were 18.8 and 0.13 at 102 Hz before fc, respectively, which was 2.1 and 0.12 times that of rGO/h-PDMS, and 6.6 and 2.1 times that of pure h-PDMS. The origin is that KH560 insulting layer increases the interlayer distance of graphene sheets to cut down the leakage current. In addition, the modulus of 1.32 vol.% KrGO/h-PDMS is less than 3 MPa.

中文翻译:

具有化学改性石墨烯的聚(二甲基硅氧烷)双峰网络渗透复合材料的介电性能增强

摘要 采用两步法制备了含有γ-(2, 3-环氧丙氧基)丙基三甲氧基硅烷(KH560)、短链聚二甲基硅氧烷(CS-PDMS)和长链聚二甲基硅氧烷改性的石墨烯的双峰网络复合材料。 ) 填充处理过的气相二氧化硅 (CL-h-PDMS)。制备了一系列具有不同填料含量的复合材料(包括还原氧化石墨烯和用 KH560 接枝的还原氧化石墨烯,分别称为 rGO 和 KrGO)以探索它们的渗透阈值(fc)。我们发现 1.32 vol.% KrGO/h-PDMS 复合材料的介电常数和损耗在 fc 之前在 102 Hz 下分别为 18.8 和 0.13,分别是 rGO/h-PDMS 的 2.1 和 0.12 倍,以及 6.6 和 2.1 倍纯 h-PDMS。其原因是KH560绝缘层增加了石墨烯片的层间距离以减少漏电流。此外,1.32 vol.% KrGO/h-PDMS 的模量小于 3 MPa。
更新日期:2020-11-01
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