With new advances in the semiconductor technology, current carrying requirements for electronic packages and interconnects (sockets) are on the rise. Although there are a lot of documented methods for determining current carrying capacity (CCC) of electrical wires, there is no specific industry standard for determining current carrying capacity of socket pins and their contact interface with package balls and pads. This paper presents a new current carrying capacity measurement method, developed specifically to address the challenges of test socket pins and their contact interface with solder balls and pads. In addition, a method for predicting CCC in future test socket pins is presented and correlated to measured data.

中文翻译：

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确定和预测测试互连引脚载流能力的新方法

随着半导体技术的新进步，对电子封装和互连（插座）的载流要求不断提高。尽管有许多确定电线载流能力 (CCC) 的文献记录方法，但没有具体的行业标准来确定插座引脚的载流能力及其与封装焊球和焊盘的接触界面。本文提出了一种新的载流能力测量方法，该方法专为解决测试插座引脚及其与焊球和焊盘的接触界面的挑战而开发。此外，还提出了一种预测未来测试插座引脚中 CCC 的方法，并将其与测量数据相关联。