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Self-limiting processes in thermal atomic layer etching of nickel by hexafluoroacetylacetone
Japanese Journal of Applied Physics ( IF 1.5 ) Pub Date : 2020-08-17 , DOI: 10.35848/1347-4065/aba9a7
Abdulrahman H. Basher 1 , Ikutaro Hamada 2 , Satoshi Hamaguchi 1
Affiliation  

In thermal atomic layer etching (ALE) of Ni, a thin oxidized Ni layer is removed by a hexafluoroacetylacetone (hfacH) etchant gas at an elevated surface temperature, and etching ceases when a metallic Ni surface appears (self-limiting step). However, atomistic details of the self-limiting step was not well understood. With periodic density-functional-theory calculations, it is found that hfacH molecules barrierlessly adsorb and tend to decompose on a metallic Ni surface, in contrast to the case of a NiO surface, where they can form volatile Ni(hfac) 2 . Our results clarify the origin of the self-limiting process in the thermal ALE.

中文翻译:

六氟乙酰丙酮对镍进行热原子层蚀刻的自限制过程

在Ni的热原子层蚀刻(ALE)中,通过六氟乙酰丙酮(hfacH)蚀刻剂气体在较高的表面温度下去除了一层氧化的Ni薄层,当出现金属Ni表面时,蚀刻停止(自限制步骤)。但是,人们对自我限制步骤的原子细节还不太了解。通过周期性的密度泛函理论计算,发现hfacH分子在金属Ni表面无障碍地吸附并易于分解,这与NiO表面可以形成挥发性Ni(hfac)2的情况相反。我们的结果阐明了热ALE中自限过程的起源。
更新日期:2020-08-18
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