Solid diffusion bonding of the copper–zinc system is preliminarily investigated as a possible bonding solution for power modules. This article proposed a method of bonding Zn foil on substrate-plated Ag to obtain the solder joints. The formation and transformation of intermetallic compounds (IMCs) in Cu–Zn and Ag–Zn joints were investigated. The results showed that the AgZn ₃ phase was compressed and moved into the solder side when competed with the Cu ₅ Zn ₈ phase, relieved the Kirkendall voids, and enhanced the connection of joints. Besides, the electrical resistivity could maintain at a competitive level of $9~\mu \Omega \cdot {\mathrm {cm}} $ , and the shear strength reached 43–75 MPa. These properties were also appreciated even after the aging test. The deformation behaviors of different IMCs were tested by nanoindentation. This work provides a potential alternative to high-temperature solders used for high-power-density electronic packaging applications.

中文翻译：

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Ag层对电力电子显微组织演变及与Zn箔结合性能的影响

初步研究了铜锌系统的固相扩散结合作为功率模块可能的结合解决方案。本文提出了一种在镀银的基片上粘合锌箔以获得焊点的方法。研究了Cu-Zn和Ag-Zn接头中金属间化合物（IMC）的形成和转变。结果表明，当与Cu ₅ Zn ₈相竞争时，AgZn ₃相被压缩并移至焊料侧 ，消除了Kirkendall空隙，并增强了接头的连接。此外，电阻率可以保持在竞争水平 $ 9〜\ mu \ Omega \ cdot {\ mathrm {cm}} $ ，剪切强度达到43-75 MPa。即使在老化测试之后，这些性能也被赞赏。通过纳米压痕测试了不同IMC的变形行为。这项工作为高功率密度电子封装应用中使用的高温焊料提供了潜在的替代方法。