Understanding the consolidation behavior of granular salt is of great significance for salt cavern repository design and the corresponding long-term safety assessments. To evaluate the influence of environmental and geological factors on the reconsolidation behavior of fine granular salt, a series of orthogonal array design experiments were performed. The experimental results showed that temperature, compressive stress, moisture content and compression time had significant impacts on the compaction properties of granular salt. The compressive stress exerted the greatest impact on porosity of the granular salt, which decreased the porosity. An increase in moisture content (within 3%) in the granular salt sample substantially reduced the porosity of the sample, whereas this effect was limited when moisture exceeded 3%. In the process of granular salt compaction, all of the deformation mechanisms were temperature dependent. The correlation between porosity and permeability of the dried compacted salt samples was independent of the environmental and geological factors during the compaction of the granular salt. The use of granular salt with a smaller particle size in the compacted salt backfill can improve its sealing performance. In the transient loading stage of granular salt compaction, the porosity decreased rapidly under stress to form a denser layer, which was mainly accomplished by particle rearrangement and cataclastic flow. However, in the constant-load creep stage, the additional porosity reduction was dominated by grain boundary processes and crystal plasticity mechanisms, including dislocation creep, pressure-solution creep and recrystallization.

了解粒状盐的固结特性对于盐穴库设计和相应的长期安全评估具有重要意义。为了评估环境和地质因素对细颗粒盐的再固结行为的影响，进行了一系列正交阵列设计实验。实验结果表明，温度，压缩应力，含水量和压缩时间对粒状盐的压实性能有显着影响。压应力对粒状盐的孔隙率影响最大，从而降低了孔隙率。颗粒状盐样品中水分含量的增加（在3％以内）大大降低了样品的孔隙率，而当水分含量超过3％时，这种影响就受到限制。在粒状盐的压实过程中，所有变形机制都与温度有关。干燥压实盐样品的孔隙率和渗透率之间的相关性与粒状盐压实过程中的环境和地质因素无关。在压实的盐回填物中使用粒径较小的粒状盐可以改善其密封性能。在粒状盐压实的瞬时加载阶段，孔隙度在应力作用下迅速下降，形成致密层，这主要是通过颗粒重排和碎裂流来实现的。然而，在恒定载荷蠕变阶段，额外的孔隙度降低主要受晶界过程和晶体塑性机制的控制，包括位错蠕变，压力-固溶蠕变和重结晶。