In future, thermal management will play a crucial role in their design and fabrication, because the rapid development in miniaturization and versatility of electronic devices leads to the huge increase in power density. It is an inevitable trend to develop flexible substrate materials with high thermal conductivity, high heat flux, excellent stability and reliability. In this work, a new flexible print circuit board (G-FPC) containing a graphene film with sandwich structure was fabricated for heat dissipation. Firstly, multi-layer graphene film (M-GF) with 739.56 W m⁻¹ K⁻¹ in-plane thermal conductivity was prepared by high-temperature heat treatment (2900 °C) of GO film followed compression rolling process. Then, as-prepared M-GF and polyimide (PI) film were laminated and hot-pressed to fabricate G-FPC with epoxy resin as adhesive. As-fabricated G-FPC exhibits excellent flexibility, stability, and reliability, whose in-plane thermal conductivity can remain 98%, 81% and 88% after 10000, 15,000 and 20,000 bending times. Moreover, as-fabricated G-FPC has good heat dissipation capacity, which can significantly reduce chip temperature, 10 °C lower than traditional FPC with the power density of 0.42 W/cm². The G-FPC with sandwich structure of PI/M-GF/PI will have potential applications in the flexible and wearable electronics in future, due to their versatility in heat dissipation, flexibility, stability and electronic interconnection as substrates.

将来，热管理将在其设计和制造中扮演至关重要的角色，因为电子设备的小型化和多功能性的快速发展导致功率密度的巨大提高。开发具有高导热率，高热通量，优异的稳定性和可靠性的柔性基板材料是必然趋势。在这项工作中，制造了一种新的柔性印刷电路板（G-FPC），其中包含具有夹层结构的石墨烯薄膜以进行散热。首先，用739.56 W m ^-1 K ^-1的多层石墨烯膜（M-GF）通过GO膜的高温热处理（2900℃），然后进行压延轧制来制备面内导热率。然后，将制备的M-GF和聚酰亚胺（PI）膜层压并热压以用环氧树脂作为粘合剂制备G-FPC。制成的G-FPC具有出色的柔韧性，稳定性和可靠性，在10000、15,000和20,000次弯曲后，其平面内导热率可以保持98％，81％和88％。而且，制成的G-FPC具有良好的散热能力，可以显着降低芯片温度，功率密度为0.42 W / cm ^2，比传统FPC降低10°C。具有PI / M-GF / PI夹层结构的G-FPC由于其在散热，灵活性，稳定性和电子互连方面的多功能性，将来将在柔性和可穿戴电子产品中具有潜在的应用。