Scaling of two dimensional six-contact phase change devices that can perform toggle logic operations is analyzed through 2D electrothermal simulations with dynamic materials modeling, integrated with CMOS access circuitry. Toggle configurations are achieved through a combination of isolation of some contacts from others using amorphous regions and coupling between different regions via thermal crosstalk. Use of thermal crosstalk as a coupling mechanism in a multi-contact device in the memory layer allows implementation of analog routing and digital logic operations at a significantly lower transistor count, with the added benefit of non-volatility. Simulation results show approximately linear improvement in peak current and voltage requirements with thickness scaling.

中文翻译：

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用于切换逻辑运算的多触点相变装置的缩放

通过二维电热模拟与动态材料建模，与 CMOS 访问电路集成，分析可以执行切换逻辑操作的二维六触点相变器件的缩放比例。切换配置是通过使用非晶区域将一些触点与其他触点隔离以及通过热串扰在不同区域之间耦合的组合来实现的。在存储器层中的多触点器件中使用热串扰作为耦合机制允许以显着减少的晶体管数量实现模拟路由和数字逻辑操作，并具有非易失性的额外好处。仿真结果表明，随着厚度缩放，峰值电流和电压要求近似线性改善。