This paper reports results of a study on copper voids seen in a back end of line (BEOL) module. The experiment was designed to study the effect of multiple parameters that can influence the occurrence of voids and their process margins. This work also reports the effect of changes in copper seed thickness on the product’s lifetime and reliability.

中文翻译：

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BEOL 铜金属层中的表面铜空洞


本文报告了对后端 (BEOL) 模块中出现的铜空洞的研究结果。该实验旨在研究可能影响空洞发生及其工艺裕度的多个参数的影响。这项工作还报告了铜籽晶厚度的变化对产品寿命和可靠性的影响。