This article reports a three-channel, noncontiguous, manifold multiplexer operating from 220 to 330 GHz, a 40% fractional operating bandwidth. The structure is designed and implemented using a set of ridged substrate integrated waveguides (SIWs). The ridged SIW improves the stopband bandwidth and reduces the overall structure size by 35% over a conventional SIW design. The triplexer utilizes an organic package substrate technology developed by Intel, featuring four thick copper metal layers and continuous trench vias in lieu of standard via fences, which significantly decrease the ohmic loss of the ridged SIW waveguides. Electromagnetic-circuit modeling and codesign techniques are adopted in the development of the triplexer structure. The fabricated triplexer is measured using banded millimeter-wave wafer probing and exhibits 3~7 dB of insertion loss in the passbands and better than 10 dB of average return loss for each of the channel filters. The measured stopband attenuation is better than 27 dB for all three channels.

中文翻译：

---

具有宽阻带、采用脊状基板集成波导的 220 至 330 GHz 歧管三工器


本文报道了一种三通道、非连续、流形多路复用器，工作频率为 220 至 330 GHz，工作带宽为 40%。该结构是使用一组脊状基板集成波导（SIW）来设计和实现的。与传统 SIW 设计相比，脊状 SIW 提高了阻带带宽，并将整体结构尺寸减小了 35%。该三工器采用英特尔开发的有机封装基板技术，具有四个厚铜金属层和连续沟槽通孔代替标准通孔栅栏，可显着降低脊状 SIW 波导的欧姆损耗。三工器结构的开发采用了电磁电路建模和协同设计技术。使用带状毫米波晶圆探测对所制造的三工器进行测量，发现通带中的插入损耗为 3~7 dB，每个通道滤波器的平均回波损耗优于 10 dB。所有三个通道的测得阻带衰减均优于 27 dB。